Insoluble anodized copper electroplating additive and preparation method thereof
ZHANG BENHAN, ZHANG WENBIN, XU YONGZHANG, WANG JIACHENG, MIAO XIANGYANG
Year of Publication 24.10.2023
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Year of Publication 24.10.2023
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Simple electrotinning bath for experiment
LIU XIANJIE, ZHANG BENHAN, XU YONGZHANG, WANG JIACHENG, MIAO XIANGYANG
Year of Publication 26.05.2023
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Year of Publication 26.05.2023
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Preparation process of developing tank cleaning agent
WANG YING, YU RONGXIANG, ZHANG BENHAN, ZHANG WENBIN, XU YONGZHANG, ZHANG YUANZHENG
Year of Publication 18.04.2023
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Year of Publication 18.04.2023
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Copper deposition device capable of improving chemical copper deposition rate
YU RONGXIANG, XU YONGZHANG, WANG JIACHENG, YU HUIXUAN, MIAO XIANGYANG
Year of Publication 06.12.2022
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Year of Publication 06.12.2022
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Device for automatically detecting copper thickness of printed circuit board (PCB) electroplated board
YU RONGXIANG, ZHANG BENHAN, XU YONGZHANG, WANG JIACHENG, MIAO XIANGYANG
Year of Publication 06.12.2022
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Year of Publication 06.12.2022
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PCB horizontal copper deposition simulation tank
YU RONGXIANG, ZHANG BENHAN, XU YONGZHANG, WANG JIACHENG, MIAO XIANGYANG
Year of Publication 18.11.2022
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Year of Publication 18.11.2022
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