Secreted frizzled-related proteins: A promising therapeutic target for cancer therapy through Wnt signaling inhibition
Zhang, Wenqiang, Zhang, Kexin, Ma, Yanhui, Song, Yixin, Qi, Tongbing, Xiong, Guoji, Zhang, Yuanzhu, Kan, Chengxia, Zhang, Jingwen, Han, Fang, Sun, Xiaodong
Published in Biomedicine & pharmacotherapy (01.10.2023)
Published in Biomedicine & pharmacotherapy (01.10.2023)
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Journal Article
Metabolic diseases and healthy aging: identifying environmental and behavioral risk factors and promoting public health
Zhang, Kexin, Ma, Yujie, Luo, Youhong, Song, Yixin, Xiong, Guoji, Ma, Yanhui, Sun, Xiaodong, Kan, Chengxia
Published in Frontiers in public health (13.10.2023)
Published in Frontiers in public health (13.10.2023)
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Journal Article
BAM15 as a mitochondrial uncoupler: a promising therapeutic agent for diverse diseases
Xiong, Guoji, Zhang, Kexin, Ma, Yujie, Song, Yixin, Zhang, Wenqiang, Qi, Tongbing, Qiu, Hongyan, Shi, Junfeng, Kan, Chengxia, Zhang, Jingwen, Sun, Xiaodong
Published in Frontiers in endocrinology (Lausanne) (11.10.2023)
Published in Frontiers in endocrinology (Lausanne) (11.10.2023)
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Journal Article
Secreted frizzled-related protein 5: A promising therapeutic target for metabolic diseases via regulation of Wnt signaling
Song, Yixin, Ma, Yujie, Zhang, Kexin, Zhang, Wenqiang, Xiong, Guoji, Qi, Tongbing, Shi, Junfeng, Qiu, Hongyan, Zhang, Jingwen, Han, Fang, Kan, Chengxia, Sun, Xiaodong
Published in Biochemical and biophysical research communications (15.10.2023)
Published in Biochemical and biophysical research communications (15.10.2023)
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Journal Article
Influence of compliant layer thickness on stress and strain of solder joints in wafer level chip scale package under thermal cycle
Liang Ying, Huang Chunyue, Zhang Xin, Li Tianming, Guo Guangkuo, Xiong Guoji, Tang Wenliang
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Study on different material parameters on TSV interconnect structures stress and strain under random vibration load
Xiong Guoji, Huang Chunyue, Li Tianming, Liang Ying, Tang Wenliang, Wu Song, Li Chunquan, Ning Zhong Ping
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
The FEM analysis of stress and strain in stacked solder bump under power load
Chunyue Huang, Guoji Xiong, Ying Liang, Song Wu, Tianming Li
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Analysis of stress and strain distribution on pad during bump bonding process
Tang Wenliang, Huang Chunyue, Li Tianming, Liang Ying, Xiong Guoji, Wu Song, Li Chunquan, Ning Zhongping
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
Published in 2014 15th International Conference on Electronic Packaging Technology (01.05.2014)
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Conference Proceeding
Finite Element Analysis of Gold Bonding under Different Loading Conditions
Liang, Ying, Wu, Song, Huang, Chun Yue, Tang, Wen Liang, Li, Tian Ming, Xiong, Guo Ji, Li, Chun Quan, Ning, Zhong Ping
Published in Applied Mechanics and Materials (01.07.2014)
Published in Applied Mechanics and Materials (01.07.2014)
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Journal Article
Band elimination filter
CHEN JIAYUAN, XIONG GUOJI, LUO GUIWEN, MENG BIHUI, GUO CHUNBO, DI YINGJIE
Year of Publication 26.03.2024
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Year of Publication 26.03.2024
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