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"XINPU ZHENG"
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"XINPU ZHENG"
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
by
CHEN XIANWEI
,
ZHENG XINPU
Year of Publication
30.08.2022
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Packaging structure and forming method thereof
by
LIN BAIYAO
,
ZHENG XINPU
Year of Publication
13.07.2021
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Interposer, semiconductor package assembly and method of forming same
by
LIN MENGLIANG
,
CHEN XIANWEI
,
ZHENG XINPU
Year of Publication
22.08.2023
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Packaging structure and forming method thereof
by
LIN MENGLIANG
,
ZHUANG BOYAO
,
ZHENG XINPU
Year of Publication
23.09.2022
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Integrated circuit package
by
LAI JIELONG
,
YANG JUNYUE
,
LIN MENGLIANG
,
CHEN XIANWEI
,
ZHENG XINPU
Year of Publication
07.05.2024
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SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
by
LAI JIELONG
,
LIN MENGLIANG
,
CHEN XIANWEI
,
ZHENG XINPU
Year of Publication
22.12.2023
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SEMICONDUCTOR DEVICE, SYSTEM INCLUDING INTEGRATED PASSIVE DEVICE, AND MANUFACTURING METHOD
by
WEI JUNHUAN
,
LIN MENGLIANG
,
CHEN XIANWEI
,
ZHENG XINPU
Year of Publication
10.11.2023
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Semiconductor device
by
LYU MENGSHENG
,
CHEN SHUOMAO
,
CHAE SANG-YUN
,
ZHENG XINPU
Year of Publication
27.10.2023
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
by
LIAO LILING
,
LIN YUSHENG
,
LAI BAICHEN
,
YOU MINGZHI
,
ZHENG XINPU
Year of Publication
29.09.2023
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Package and method of forming same
by
CHEN YINGRU
,
CHEN SHUOMAO
,
LIN MENGLIANG
,
ZHENG XINPU
,
CHEN XIANWEI
Year of Publication
22.08.2023
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Semiconductor structure, substrate package and method of forming semiconductor structure
by
LIAO LILING
,
XU JIAGUI
,
YOU MINGZHI
,
ZHENG XINPU
Year of Publication
08.08.2023
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Semiconductor structure, packaging structure and packaging method
by
CHEN SHUOMAO
,
ZHUANG BOYAO
,
ZHENG XINPU
Year of Publication
30.11.2021
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Semiconductor package and method of forming same
by
LIN JIFU
,
YOU JIANTONG
,
LIN JIAXIANG
,
ZHENG XINPU
Year of Publication
01.08.2023
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Method of forming package structure
by
CHEN SHUOMAO
,
XU FENGCHENG
,
ZHENG XINPU
Year of Publication
04.04.2023
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Semiconductor device and manufacturing method thereof
by
ZHUANG BOYAO
,
YANG CHANGYI
,
ZHENG XINPU
Year of Publication
27.07.2021
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Semiconductor device and manufacturing method thereof
by
ZHOU MENGWEI
,
ZHUANG BOYAO
,
ZHENG XINPU
Year of Publication
29.06.2021
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Packaging structure and forming method thereof
by
LIN YUSHENG
,
LIN BAIYAO
,
CHEN JIANHONG
,
LAI BAICHEN
,
ZHENG XINPU
Year of Publication
03.01.2023
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Packaging structure and forming method thereof
by
LIN YUSHENG
,
LIN BAIYAO
,
LAI BAICHEN
,
YOU MINGZHI
,
ZHENG XINPU
Year of Publication
03.01.2023
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Chip package structure and forming method thereof
by
LIN BAIYAO
,
WANG JINHUA
,
LAI BAICHEN
,
YOU MINGZHI
,
ZHENG XINPU
Year of Publication
03.01.2023
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Manufacturing method of chip packaging structure
by
CHEN SHUOMAO
,
XU FENGCHENG
,
ZHENG XINPU
Year of Publication
30.12.2022
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