Theoretical Models on Interfacial Thermal Conductance of Nanoscale Solid Interfaces in Chips: A Mini Review
Zong, Zhicheng, Chen, Xiandong, Yan, Bin, Xie, Yelei, Pang, Jian, Li, Guangyao, Hu, Jiqiang, Wu, Zhipeng, Li, Bo, Fang, Haisheng, Yang, Nuo
Published in Chinese physics letters (01.10.2024)
Published in Chinese physics letters (01.10.2024)
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Journal Article
Common Mode Noise Analysis inside the Integrated Circuits
Long, Faming, Zhang, Li, Jia, Liwei, Zhang, Jiangtao, Yu, Bin, Xie, Yelei
Published in 2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC) (20.10.2023)
Published in 2023 IEEE 7th International Symposium on Electromagnetic Compatibility (ISEMC) (20.10.2023)
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Conference Proceeding
A UCIe Interconnect Channel Design Up to 32Gbps on 2.5D Si-Interposer
Li, Yongbin, Zhang, Jiangtao, Wu, Feng, Xie, Yelei, Pang, Jian, Li, Guangyao
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
A Modularized Thermal Test Chip Design and Verification
Sun, Jianjun, Wang, Deping, Zhou, Shiying, Yan, Bin, Xie, Yelei, Pang, Jian, Li, Guangyao, Ouyang, Keqing
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
Published in 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) (17.03.2024)
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Conference Proceeding
Design Optimization and Performance Evaluation of Direct Liquid Single-Phase Jet Impingement Heat Sink for High-Performance Computing Chips
Lin, Kang, Wang, Zhizhen, Yan, Bin, Xie, Yelei, Pang, Jian, Sun, Jianijun, Xiao, Xiong, Ma, Shenglin, Chen, Xiandong
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
Published in 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (07.08.2024)
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Conference Proceeding
Isothermal device
LIU HUSHENG, LIU XIAOHUI, ZHENG SHENGQING, LUAN HAIFENG, WANG JIANLEI, XIE YELEI
Year of Publication 22.03.2024
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Year of Publication 22.03.2024
Patent
Automatic testing device for minimum placement depth of temperature sensor
LIU HUSHENG, LIU XIAOHUI, ZHENG SHENGQING, PENG GANG, LUAN HAIFENG, WANG JIANLEI, XIE YELEI
Year of Publication 22.03.2024
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Year of Publication 22.03.2024
Patent
Combined type steel mold for concrete prefabricated laminated slab
WANG LIQIN, HIRAMASU SHIGERU, ZHOU WEIHUA, ZHANG XUAN, REN YIFAN, HAN FEI, HUI JIANGNA, HE PENGCHANG, XIE YELEI, ZHU MINGHUI
Year of Publication 10.05.2024
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Year of Publication 10.05.2024
Patent
Portable unmanned aerial vehicle ejection frame
WANG YING, CHEN MENGHONG, LIU GUOMIAO, FENG LING, CHAI SHENGSHENG, LIU WEIYING, LIN RUN, LI TINGJIE, XIE YELEI, WANG YAN
Year of Publication 20.01.2023
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Year of Publication 20.01.2023
Patent