Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems
Biancun Xie, Swaminathan, M., Ki Jin Han, Jianyong Xie
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
Published in 2011 IEEE International Symposium on Electromagnetic Compatibility (01.08.2011)
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Conference Proceeding
Symbolic moment computation with application to statistical timing analysis
Biancun Xie
Published in 2009 Asia Pacific Conference on Postgraduate Research in Microelectronics & Electronics (PrimeAsia) (01.11.2009)
Published in 2009 Asia Pacific Conference on Postgraduate Research in Microelectronics & Electronics (PrimeAsia) (01.11.2009)
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Conference Proceeding
Extracting Relevance Information from User Click through Data Using Conditional Random Field
Biancun Xie
Published in 2009 International Conference on Computational Intelligence and Software Engineering (01.12.2009)
Published in 2009 International Conference on Computational Intelligence and Software Engineering (01.12.2009)
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Conference Proceeding
Electromagnetic modeling of non-uniform through-silicon via (TSV) interconnections
Biancun Xie, Swaminathan, M.
Published in 2012 IEEE 16th Workshop on Signal and Power Integrity (SPI) (01.05.2012)
Published in 2012 IEEE 16th Workshop on Signal and Power Integrity (SPI) (01.05.2012)
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Conference Proceeding
Modeling and analysis of SSN in silicon and glass interposers for 3D systems
Biancun Xie, Swaminathan, M.
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
Published in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2012)
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Conference Proceeding
3차원 PDN(Power Distribution Network) 커패시터 통합
KHAN IRFAN, PANDEY SHREE KRISHNA, MIRANDA CORBALAN MIGUEL, SONG STANLEY SEUNGCHUL, XIE BIANCUN
Year of Publication 12.01.2024
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Year of Publication 12.01.2024
Patent
3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer
Biancun Xie, Swaminathan, Madhavan, Ki Jin Han, Jianyong Xie
Published in 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI) (01.05.2014)
Published in 2014 IEEE 18th Workshop on Signal and Power Integrity (SPI) (01.05.2014)
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Conference Proceeding
Electrical-thermal modeling of through-silicon via (TSV) arrays in interposer
Xie, Jianyong, Xie, Biancun, Swaminathan, Madhavan
Published in International journal of numerical modelling (01.11.2013)
Published in International journal of numerical modelling (01.11.2013)
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Journal Article
Power Delivery Decoupling Scheme for EMIB Packages
Xie, Biancun, Xie, Jianyong
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
Published in 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (01.10.2019)
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Conference Proceeding