3D-printed highly stable flexible strain sensor based on silver-coated-glass fiber-filled conductive silicon rubber
Zhao, Chen, Xia, Zhidong, Wang, Xuelong, Nie, Jingkai, Huang, Pei, Zhao, Shaofan
Published in Materials & design (01.08.2020)
Published in Materials & design (01.08.2020)
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Effects of Copper(II) Oxide on the Co-Pyrolysis of Waste Polyester Enameled Wires and Poly(vinyl chloride)
Wang, Xiaolu, Li, Bingyi, Xia, Zhidong, Zhou, Wei, Wu, Yufeng, Zhu, Zhaoxi, Zhu, Guangze
Published in Polymers (20.12.2023)
Published in Polymers (20.12.2023)
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Influence of Deposition Patterns on Distortion of H13 Steel by Wire-Arc Additive Manufacturing
Li, Xufeng, Lin, Jian, Xia, Zhidong, Zhang, Yongqiang, Fu, Hanguang
Published in Metals (Basel ) (01.03.2021)
Published in Metals (Basel ) (01.03.2021)
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Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy
Dong, Wenxing, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (01.07.2008)
Published in Journal of electronic materials (01.07.2008)
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Journal Article
Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder
Shi, Yaowu, Tian, Jun, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of alloys and compounds (03.04.2008)
Published in Journal of alloys and compounds (03.04.2008)
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Journal Article
Microstructure and electrical conductivity of Ce0.9Gd0.1O1.95-MgO composite electrolyte
Zhang, Heng, Meng, Bin, Xia, Zhidong, Zheng, Qian, Ping, Xinyu, Liang, Wenke
Published in Ionics (01.05.2020)
Published in Ionics (01.05.2020)
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Investigation of rare earth-doped BiAg high-temperature solders
Shi, Yaowu, Fang, Weiping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.09.2010)
Published in Journal of materials science. Materials in electronics (01.09.2010)
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Journal Article
Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of alloys and compounds (18.02.2010)
Published in Journal of alloys and compounds (18.02.2010)
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Journal Article
Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach
Xu, Guangchen, Guo, Fu, Wang, Xitao, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of alloys and compounds (21.01.2011)
Published in Journal of alloys and compounds (21.01.2011)
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Journal Article
Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint
Xiao, WeiMin, Shi, YaoWu, Xu, GuangChen, Ren, Ren, Guo, Fu, Xia, ZhiDong, Lei, YongPing
Published in Journal of alloys and compounds (20.03.2009)
Published in Journal of alloys and compounds (20.03.2009)
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Journal Article
Microstructure Evolution of SnAgCuEr Lead-free Solders Under High Temperature Aging
Hao, Hu, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu
Published in Journal of electronic materials (2008)
Published in Journal of electronic materials (2008)
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Journal Article
Conference Proceeding
Creep property of composite solders reinforced by nano-sized particles
Shi, Yaowu, Liu, Jianping, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.04.2008)
Published in Journal of materials science. Materials in electronics (01.04.2008)
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Journal Article
Creep Properties of Composite Solders Reinforced with Nano- and Microsized Particles
Shi, Yaowu, Liu, Jianping, Yan, Yanfu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.04.2008)
Published in Journal of electronic materials (01.04.2008)
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Journal Article
Effect of rare earth element addition on the microstructure of Sn-Ag-Cu solder joint
Li, Bo, Shi, Yaowu, Lei, Yongping, Guo, Fu, Xia, Zhidong, Zong, Bin
Published in Journal of electronic materials (01.03.2005)
Published in Journal of electronic materials (01.03.2005)
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Journal Article
Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
Li, Guangdong, Shi, Yaowu, Hao, Hu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of materials science. Materials in electronics (01.02.2009)
Published in Journal of materials science. Materials in electronics (01.02.2009)
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Journal Article
Effects of Rare-Earth Addition on Properties and Microstructure of Lead-Free Solder Balls
Yu, Yang, Xia, Zhidong, Guo, Fu, Shi, Yaowu
Published in Journal of electronic materials (01.07.2008)
Published in Journal of electronic materials (01.07.2008)
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Journal Article
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration
Guo, Fu, Xu, Guangchen, Sun, Jia, Xia, Zhidong, Lei, Yongping, Shi, Yaowu, Li, Xiaoyan
Published in Journal of electronic materials (01.12.2009)
Published in Journal of electronic materials (01.12.2009)
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Journal Article
Conference Proceeding
Comparison of Impact Toughness and Fracture Morphologies Between Pb-Containing and Pb-Free Solder Joints Subject to the Charpy Impact Test
Zhang, Ning, Shi, Yaowu, Xia, Zhidong, Lei, Yongping, Guo, Fu, Li, Xiaoyan
Published in Journal of electronic materials (01.10.2008)
Published in Journal of electronic materials (01.10.2008)
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