Method for manufacturing a packaging substrate, and packaging substrate
FENG, LEI, HUANG, BEN-XIA, HUANG, GAO, CHEN, XIAN-MING, LIN, WEN-JIAN
Year of Publication 01.08.2023
Get full text
Year of Publication 01.08.2023
Patent
Embedded inductance structure and manufacturing method thereof
HUANG, BEN-XIA, FENG, JIN-DONG, HUANG, GAO, XU, XIAO-WEI, CHEN, XIAN-MING
Year of Publication 01.07.2023
Get full text
Year of Publication 01.07.2023
Patent
Substrate manufacturing method, embedded substrate and semiconductor
HUANG, BEN-XIA, HUANG, JUN, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING, LIN, WEN-JIAN
Year of Publication 16.05.2024
Get full text
Year of Publication 16.05.2024
Patent
Plastic package cavity structure and manufacturing method thereof
FENG, LEI, HUANG, BEN-XIA, ZHAO, JIANG-JIANG, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
Year of Publication 16.04.2024
Get full text
Year of Publication 16.04.2024
Patent
Semiconductor packaging structure and preparation method thereof
FENG, LEI, HUANG, BEN-XIA, HUANG, JUN, LI, QIAO-LING, GAO, JUN, CHEN, XIAN-MING
Year of Publication 01.04.2024
Get full text
Year of Publication 01.04.2024
Patent
Manufacturing method of high-heat-dissipation mixed substrate and semiconductor structure
HUANG, BEN-XIA, QIN, CHAO-BIAO, HUANG, JUN, HUANG, GAO, XU, XIAO-WEI, CHEN, XIAN-MING
Year of Publication 16.03.2024
Get full text
Year of Publication 16.03.2024
Patent
METHOD FOR MAKING INTEGRATED PASSIVE DEVICE PACKAGE STRUCTURE
HUANG, BEN-XIA, FENG, LEI, XIE, BING-SEN, HONG, YE-JIE, CHEN, XIAN-MING
Year of Publication 01.04.2023
Get full text
Year of Publication 01.04.2023
Patent
Substrate embedded with integrated inductor and manufacturing method thereof
HUANG, BEN XIA, HUANG, JU CHEN, HUANG, GAO, XU, XIAO WEI, CHEN, XIAN MING
Year of Publication 21.11.2023
Get full text
Year of Publication 21.11.2023
Patent