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Published in Hong wai yu hao mi bo xue bao (13.06.2012)
Published in Hong wai yu hao mi bo xue bao (13.06.2012)
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TWI772132B
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Year of Publication 21.07.2022
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Year of Publication 21.07.2022
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TWI772152B
FENG, LEI, HUANG, BEN-XIA, FENG, JIN-DONG, XIN, SHI-GUI, LI, MIN-XIONG, CHEN, XIAN-MING, WANG, WEN-SHI
Year of Publication 21.07.2022
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Year of Publication 21.07.2022
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CdZnTe detectors with parallel capacitive Frisch grid: CdZnTe detectors with parallel capacitive Frisch grid
SHI, Zhu-Bin, WANG, Lin-Jun, MIN, Jia-Hua, QIN, Kai-Feng, LIANG, Xiao-Yan, ZHANG, Ji-Jun, HUANG, Jian, TANG, Ke, XIA, Yi-Ben
Published in Hong wai yu hao mi bo xue bao (20.03.2012)
Published in Hong wai yu hao mi bo xue bao (20.03.2012)
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HEAT DISSIPATION EMBEDDED PACKAGING METHOD
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Year of Publication 21.05.2021
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Year of Publication 21.05.2021
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Embedded packaging structure having shielding cavity and manufacturing method thereof
FENG, LEI, HUANG, BEN-XIA, JIANG, LI-NA, GU, MIN, CHEN, XIAN-MING, WANG, WEN-SHI
Year of Publication 01.04.2022
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Year of Publication 01.04.2022
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Embedded package structure and manufacturing method thereof
HUANG, BEN-XIA, FENG, LEI, FENG, JIN-DONG, XIE, BING-SEN, JIANG, LI-NA, CHEN, XIAN-MING
Year of Publication 16.02.2022
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Year of Publication 16.02.2022
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