Search Results - "Wymyslowski, Artur" :: K.UTB vyhledávací portál

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Guest Editorial: 2016 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2017)

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Guest Editorial: 2015 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2016)

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Guest Editorial: 2014 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.04.2015)

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Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.06.2014)

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Strength analysis of solder joints used in microelectronics packaging

by Wymysłowski, Artur, Jankowski, Krystian
Published in Eksploatacja i niezawodność (01.01.2020)

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Guest Editorial: 2012 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.08.2013)

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2011 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2012)

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Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.07.2010)

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Adhesion work analysis through molecular modeling and wetting angle measurement

by Król, Dawid Jan, Wymysłowski, Artur, Allaf, Kamil Nouri
Published in Microelectronics and reliability (01.04.2015)

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Application of nanoindentation technique for investigation of elasto-plastic properties of the selected thin film materials

by WYMYSLOWSKI, Artur, DOWHAN, Lukasz
Published in Microelectronics and reliability (01.03.2013)

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Guest Editorial: 2007 EuroSimE conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.06.2008)

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Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur
Published in Microelectronics and reliability (01.12.2007)

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Multi-objective decision support system in numerical reliability optimization of modern electronic packaging

by Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer
Published in Microsystem technologies : sensors, actuators, systems integration (01.12.2009)

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Numerical prototyping methods in microsystem accelerometers design

by Dowhań, Łukasz, Wymysłowski, Artur, Kaliciński, Stanisław, Janus, Paweł
Published in Microelectronics and reliability (01.07.2011)

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Extraction of elastic–plastic material properties of thin films through nanoindentaion technique with support of numerical methods

by Dowhań, Łukasz, Wymysłowski, Artur, Janus, Paweł, Ekwińska, Magdalena, Wittler, Olaf
Published in Microelectronics and reliability (01.06.2011)

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An approach of numerical multi-objective optimization in stacked packaging

by Dowhań, Łukasz, Wymysłowski, Artur, Dudek, Rainer
Published in Microelectronics and reliability (01.06.2008)

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Numerical approach to characterization of thermally conductive adhesives

by Fałat, Tomasz, Wymysłowski, Artur, Kolbe, Jana
Published in Microelectronics and reliability (01.02.2007)

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Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

by Wymysłowski, Artur, Vandevelde, Bart, Andersson, Dag
Published in Microelectronics and reliability (01.02.2007)

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Influence of matrix viscoelastic properties on thermal conductivity of TCA – Numerical approach

by Falat, Tomasz, Wymysłowski, Artur, Kolbe, Jana, Jansen, Kaspar M.B., Ernst, Leo
Published in Microelectronics and reliability (01.12.2007)

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Lab-on-Chip Platform for Culturing and Dynamic Evaluation of Cells Development

by Podwin, Agnieszka, Lizanets, Danylo, Przystupski, Dawid, Kubicki, Wojciech, Śniadek, Patrycja, Kulbacka, Julita, Wymysłowski, Artur, Walczak, Rafał, Dziuban, Jan A
Published in Micromachines (Basel) (14.02.2020)

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