A multi-scale approach of the thermo-mechanical properties of silica-filled epoxies used in electronic packaging
Weltevreden, E.R., Tesarski, S.J., Wymyslowski, A., Erinc, M., Gielen, A.W.J.
Published in Microelectronics and reliability (01.07.2012)
Published in Microelectronics and reliability (01.07.2012)
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Conference Proceeding
Advanced numerical prototyping methods in modern engineering applications – Optimisation for micro-electronic package reliability
Wymysłowski, A., van Driel, W.D., van de Peer, J., Tzannetakis, N., Zhang, G.Q.
Published in Microelectronics and reliability (01.02.2007)
Published in Microelectronics and reliability (01.02.2007)
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Journal Article
Conference Proceeding
Analytical, numerical and experimental approach to thermal analysis and design of a travelling wave tube
Wiejak, W., Wymyslowski, A.
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding
Analytical, numerical and experimental approach to analysis properties of a silicon membrane pressure sensor
Wymyslowski, A., Gorecka-Drzazga, A., Sarelo, K.
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
Published in 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2016)
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Conference Proceeding
Creep and fatigue as main degradation phenomena in reliability of solder joints
Jankowski, K., Wymyslowski, A.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Methodology for supporting electronic system prototyping through semiautomatic component selection
Swierczynski, R., Urbanski, K., Wymyslowski, A.
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Low-power smart sensor for laminar and turbulent flow detection in avionics application
Swierczynski, R., Urbanski, K., Wymyslowski, A., Jankowski, K.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
A systematic method for optimizing the electron beam hardening process
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Journal Article
Conference Proceeding
Maintenance of solder joints on the strength of simultaneously acting creep and fatigue phenomena by using microindentation technique
Jankowski, K., Swierczynski, R., Urbanski, K., Wymyslowski, A., Chicot, D., Dudek, R.
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
Published in 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2013)
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Conference Proceeding
A multi-scale approach to the thermo-mechanical behaviour of silica-filled epoxies for electronic packaging
Weltevreden, E R, Erinc, M, Tesarski, S J, Wymyslowski, A, Mavinkurve, A, Giele, A W J
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
Published in 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2011)
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Conference Proceeding
Sequential approach to numerical optimization of the LTCC ceramic pressure sensor
Wymyslowski A, Santo-Zarnik, M., Belavic, D.
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding
Numerical simulation and optimisation of the vacuum microsensor
Wymyslowski, A., Urbanski, K.J., Berlicki, T.M.
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
Published in EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005 (2005)
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Conference Proceeding
Numerical simulation and experimental verification of the thermal contact properties of the polymers bonds
Wymyslowski, A., Falat, T., Friedel, K., Felba, J.
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
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Conference Proceeding
Advanced numerical prototyping methods in modern engineering applications
van Driel, W.D., van de Peer, J., Tzannetakis, N., Wymyslowski, A., Zhang, G.Q.
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
Published in 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, 2004. EuroSimE 2004. Proceedings of the (2004)
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Conference Proceeding