Developing the AM G-code based thermomechanical finite element platform for the analysis of thermal deformation and stress in metal additive manufacturing process
Mashhood, Muhammad, Peters, Bernhard, Zilian, Andreas, Baroli, Davide, Wyart, Eric
Published in Journal of mechanical science and technology (01.03.2023)
Published in Journal of mechanical science and technology (01.03.2023)
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Journal Article
On the Influence of Capillary-Based Structural Health Monitoring on Fatigue Crack Initiation and Propagation in Straight Lugs
Moonens, Marc, Wyart, Eric, De Baere, Dieter, Hinderdael, Michaël, Ertveldt, Julien, Jardon, Zoé, Arroud, Galid, Guillaume, Patrick
Published in Materials (12.09.2019)
Published in Materials (12.09.2019)
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Journal Article
Damage tolerance reliability analysis combining Kriging regression and support vector machine classification
Chocat, Rudy, Beaucaire, Paul, Debeugny, Loïc, Lefebvre, Jean-Pierre, Sainvitu, Caroline, Breitkopf, Piotr, Wyart, Eric
Published in Engineering fracture mechanics (01.07.2019)
Published in Engineering fracture mechanics (01.07.2019)
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Journal Article
Crack propagation methodology under complex loadings
Dompierre, Benoît, Mesbah, Majid, Wyart, Eric
Published in Engineering fracture mechanics (01.07.2015)
Published in Engineering fracture mechanics (01.07.2015)
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Journal Article
A substructured FE-shell/XFE-3D method for crack analysis in thin-walled structures
Wyart, E., Coulon, D., Duflot, M., Pardoen, T., Remacle, J.-F., Lani, F.
Published in International journal for numerical methods in engineering (12.11.2007)
Published in International journal for numerical methods in engineering (12.11.2007)
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Journal Article
Surrogate model based mechanical characterization of lead-free soldered joint material exhibiting ratcheting behavior: An advanced methodology
Dompierre, Benoit, Barriere, Ludovic, Francois, Arnaud, Wyart, Eric
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
Published in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (01.04.2015)
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Conference Proceeding