High-performance nickel wick development for loop heat pipes
Wuttijumnong, V., Singh, R., Mochizuki, M., Goto, K., Thang Nguyen, Tien Nguyen, Mashiko, K.
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
Published in 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) (01.03.2012)
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Conference Proceeding
Low Profile-High Performance Vapor Chamber Heat Sinks For Cooling High-Density Blade Servers
Xiao Ping Wu, Mochizuki, M., Thang Nguyen, Saito, Y., Wuttijumnong, V., Ghisoiu, H., Kumthonkittikul, V., Sukkasaem, P., Nimitkiatklai, P., Kiyooka, F.
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
Published in Twenty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (01.03.2007)
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Conference Proceeding
Overview latest technologies using heat pipe and vapor chamber for cooling of high heat generation notebook computer
Wuttijumnong, V., Nguyen, T., Mochizuki, M., Mashiko, K., Saito, Y.
Published in Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) (2004)
Published in Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545) (2004)
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Conference Proceeding
Analyzing and modeling on optimized L-ratio of evaporator section to condenser section for micro heat pipe heat sinks
Xiao Ping Wu, Mochizuki, M., Saito, Y., Nguyen, T., Wuttijumnong, V., Wu, D.
Published in Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003 (2003)
Published in Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003 (2003)
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Conference Proceeding
Thermal management in high performance computers by use of heat Pipes and vapor chambers, and the challenges of global warming and environment
Mochizuki, M., Nguyen, T., Mashiko, K., Saito, Y., Xiao Ping Wu, Wuttijumnong, V.
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
Published in 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (01.10.2009)
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Conference Proceeding
Thermal performance of miniature loop heat pipe operating under different heating modes
Singh, R., Akbarzadeh, A., Mochizuki, M., Saito, Y., Nguyen, T., Kiyooka, F., Wuttijumnong, V.
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)
Published in Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006 (2006)
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Conference Proceeding