Managing BGA test socket SI characterization
Lin Chee-Hoe, Ng Hui-Ying, Wong Wui-Weng
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
A wide frequency band characterization technique for multiple-terminal discrete decoupling capacitors
Hui-Ying Ng, Wui-Weng Wong
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Impedance Characterization of Power Delivery Network in a Flip Chip Package on a Printed Circuit Board
Suat-Mooi, Low, Fei, Guo, Wui-Weng, Wong
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
The IEEE EPS Packaging Benchmark Suite
Guo, Fei, Aygun, Kemal, Becker, W. Dale, Talocia, Stefano Grivet, Hejase, Jose A., Wong, Wui-Weng, Zhou, Tingdong, Barnes, Heidi, Peng, Zhen, Pelger, Alexander, Sahouli, Mohamed, Schutt-Aine, Jose, Ling, Feng, Griese, Elmar, Paladhi, Pavel Roy, Sharma, Rohit, Pham, Nam, Winkel, Thomas-Michael, Fledell, Evan, Hill, Michael J., Silva, Benjamin, Hu, Kaisheng, Aronsson, Jonatan, Liu, Chang, Jeong, Yiru, Yilmaz, Ali E.
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
Published in 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (17.10.2021)
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Conference Proceeding
Current density and hot spot prediction using electrical-thermal co-simulation for multi-layer IC packages
Lin Chee-Hoe, Wong Wui-Weng, Liu Bao-Min
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
Published in 2006 8th Electronics Packaging Technology Conference (01.12.2006)
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Conference Proceeding
Current carry capacity characterization for high performance system on chip packages
Ng Hui Ying, Wong Wui Weng
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
DC analysis for power delivery in board design by post-layout simulation
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Conference Proceeding