Evaluation of Fatigue Crack Growth in Solder Layer of IGBT Module under Power Cycle by Using J-integral Method
Yang, Kai, Zhou, Longzao, Wu, Fengshun, Zhang, Yi, Han, Yang, Zhang, Zhou, Wan, Yang, Huang, Xiangmiao, Huang, Dayong
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Influence of IMC morphology on fatigue stress, strain and life of solder layer between SiC chip and DBC substrate in IGBT under thermal cycling
Yang, Guang, Wu, Fengshun, Zhou, Longzao, Luan, Xinghe, Zou, Xinrui, Liu, Hui, Wan, Yang, Zhang, Xiaowei, Wang, Bin
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
Published in 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) (14.09.2021)
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Conference Proceeding
Analysis of dynamic behavior of solder reflow by solder ball test
An Bing, Zheng Zonglin, Wu Fengshun, Lu Jun, Zhang Xiaodong, Wu Yiping
Published in Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) (2004)
Published in Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) (2004)
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Conference Proceeding
Analysis of RF transmission performance of 3D TSV interposer
Wang, Zhengduo, Wu, Fengshun, Lang, Liang, Wang, Bo
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Passive Millimeter-wave Radiation Imaging Simulation of complex three-dimensional Target
Du, Yuxin, Zhang, Jing, Miao, Can, Gui, Liangqi, Wu, Fengshun, Lang, Liang
Published in 2019 IEEE International Conference on Computational Electromagnetics (ICCEM) (01.03.2019)
Published in 2019 IEEE International Conference on Computational Electromagnetics (ICCEM) (01.03.2019)
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Conference Proceeding
Failure mechanisms of solder interconnects under current stressing - A progress update from recent studies on novel interconnect materials
Chan, Yan Cheong, Li, Yi, Wu, Fengshun, Chen, Zhong
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
Published in 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC) (01.11.2016)
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Conference Proceeding
Wettability and Shear Strength of SAC305 Based Composite Solder with co-doping X (Ni or Al2O3) and CNTs Reinforcements
Mo, Liping, Hu, Sicong, Zhou, Zheng, Wu, Fengshun, Liu, Shiyuan, Liu, Hui
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
Published in 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2018)
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Conference Proceeding
Effects of ZrO2 nanoparticles on the mechanical properties of Sn42Bi58 solder joint
Zhu, Ze, Chan, Yan-cheong, Wu, Fengshun
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
Published in 2015 16th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2015)
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Conference Proceeding
Effects of thermo-mechanical stress in solder joints under high current stressing
Zhang, Jinsong, Wu, Yiping, Xi, Hongjia, An, Bing, Wu, Fengshun
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
Published in 2007 8th International Conference on Electronic Packaging Technology (01.08.2007)
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Conference Proceeding