Fabrication and characterization of Cu-Sn-Ni-Cu interconnection microstructure for electromigration studies in 3D integration
Xiao, Ming, Munief, Walid Madhat, Wu, Fengshun, Lilischkis, Rainer, Oberbillig, Tobias, Saumer, Monika, Xia, Weisheng
Published in Soldering & surface mount technology (01.01.2016)
Published in Soldering & surface mount technology (01.01.2016)
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Journal Article
Finite element analysis of Sn-Ag-Cu solder joint failure under impact test
Ganran Tang, Bing An, Yiping Wu, Fengshun Wu
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
Mechanical property and reliability of anisotropic conductive adhesive in surface mount applications
Huang Lin, Zhou Liangjie, Liu Hui, Wu Fengshun, Xia Weisheng, Fu Hongzhi, Wang Shiyu, Liu Zhe
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
Effect of reflow conditions on the die shear strength in flip chip on board with SAC305 solder joints
Zhou Liangjie, Huang Lin, Wu Fengshun, Liu Hui, Xia Weisheng, Fu Hongzhi, Wang Shiyu, Liu Zhe
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl 2 O 3 composite solder
Chen, Guang, Huang, Bomin, Liu, Hui, Chan, Y.C., Tang, Zirong, Wu, Fengshun
Published in Soldering & surface mount technology (04.04.2016)
Published in Soldering & surface mount technology (04.04.2016)
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Journal Article
Research on dimensional change characteristics of silver halide films for multi-layer PCBs
Liangjie Zhou, Weihong Peng, Dong Liu, Rubin Zou, Xuefei Jiang, Weisheng Xia, Fengshun Wu
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
Published in 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging (01.08.2011)
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Conference Proceeding
Effect of stand-off height on the reliability of Cu/Sn-4.8Bi-2Ag/Cu solder joint
Hui Liu, Longzao Zhou, Jun Li, Fengshun Wu, Yiping Wu
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
Deformation analysis of Multilayer Board in the lamination process
Peng Xu, Dan Deng, Dong Liu, Tuanfen Gao, Fengshun Wu, Longzao Zhou, Weihong Peng
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
Effect of Cu substrate and solder alloy on the formation of kirkendall voids in the solder joints during thermal aging
Jian Zou, Liping Mo, Fengshun Wu, Bo Wang, Hui Liu, Jun Zhang, Yiping Wu
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
Finite element thermal analysis for high power multi-chip light emitting diode
Longzao Zhou, Hongtao Chen, Bing An, Fengshun Wu, Yiping Wu
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
Reliability of RFID tag inlay assembled by anisotropic conductive adhesive
Bing An, Yiping Wu, Xionghui Cai, Fengshun Wu
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
The effect of drilling parameters on the wicking in high density PCB processing
Liquan Wang, Fengshun Wu, Longzao Zhou, Dong Liu, Tuanfen Gao, Xuefei Jiang
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
Published in 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2010)
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Conference Proceeding
RFID Tag Packaging with Anisotropically Conductive Adhesive
Huabin Chu, Bing An, Fengshun Wu, Yiping Wu
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Analysis of Dark Stain on Chip Surface of High-Power LED
Fan Wu, Yiping Wu, Bing An, Fengshun Wu
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
Published in 2006 7th International Conference on Electronic Packaging Technology (01.08.2006)
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Conference Proceeding
Effect of miniaturization on the microstructure and mechanical property of solder joints
Bo Wang, Fengshun Wu, Jin Peng, Hui Liu, Yiping Wu, Yuebo Fang
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
Effect of Stand-Off Height on Microstructure and Tensile Strength of Cu/Sn9Zn/Cu Solder Joint
Fengshun Wu, Bo Wang, Bin Du, Bing An, Yiping Wu
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
Effect of thermomigration in eutectic SnPb solder layer
Yuan Tao, Lan Ding, Yuhui Yao, Bing An, Fengshun Wu, Yiping Wu
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
Published in 2009 International Conference on Electronic Packaging Technology & High Density Packaging (01.08.2009)
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Conference Proceeding
Effect of stand-off height on microstructure and tensile strength of Cu/Sn-8Zn-3Bi/Cu and Cu/Sn-9Zn/Cu solder joints
Bin Du, Fengshun Wu, Bo Wang, Hui Liu, Bing An, Yiping Wu
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Evaluate anti-shock property of solder bumps by impact test
Hongjia Xi, Minyi Lou, Bing An, Fengshun Wu, Yiping Wu
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding