Review on test vehicles for electromigration (EM) study in solder interconnects
Ze Zhu, Yan-cheong Chan, Fengshun Wu, Chee Lip Gan, Zhong Chen
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
Mechanical property of Cu-Sn-Ni intermetallics in the full intermetallic micro-joints formed with transient liquid phase soldering
Liping Mo, Zheng Zhou, Fengshun Wu, Shiyuan Liu, Hui Liu, Changqing Liu
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
Published in 2017 18th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2017)
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Conference Proceeding
A comparison study of electromigration in In-48Sn solder interconnects with Cu and Au/Ni/Cu pads
Yi Li, Chan, Y. C., Fengshun Wu
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
Published in 2016 International Conference on Electronics Packaging (ICEP) (01.04.2016)
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Conference Proceeding
Investigation in microstructure and mechanical properties of Ni-coated multi-wall carbon nanotubes doped Sn3.0Ag0.5Cu solder alloys
Hua Xiao, Yan-cheong Chan, Ze Zhu, Fengshun Wu
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Si/Si bonding based on self-propagating exothermic reaction
Anna Zhang, Zheng Zhou, Wenbo Zhu, Liping Mo, Fengshun Wu
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
Published in 2016 17th International Conference on Electronic Packaging Technology (ICEPT) (01.08.2016)
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Conference Proceeding
Enhanced electromigration (EM) reliability of Sn58Bi solder due to the incorporation of ZrO2 nanoparticles
Ze Zhu, Yi Li, Fengshun Wu, Yan-cheong Chan
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
Published in 2016 6th Electronic System-Integration Technology Conference (ESTC) (01.09.2016)
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Conference Proceeding
Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles
Chen, Guang, Liu, Li, Du, Juan, Silberschmidt, Vadim V., Chan, Y. C., Liu, Changqing, Wu, Fengshun
Published in Journal of materials science (01.11.2016)
Published in Journal of materials science (01.11.2016)
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Journal Article
Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction
Zhou, Zheng, Mo, Liping, Liu, Hui, Chan, Y. C., Wu, Fengshun
Published in Journal of electronic materials (01.12.2018)
Published in Journal of electronic materials (01.12.2018)
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Journal Article
Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing
Li, Yi, Lim, Adeline B.Y., Luo, Kaiming, Chen, Zhong, Wu, Fengshun, Chan, Y.C.
Published in Journal of alloys and compounds (15.07.2016)
Published in Journal of alloys and compounds (15.07.2016)
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Journal Article
Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient
Chen, Guang, Liu, Li, Silberschmidt, Vadim V., Liu, Changqing, Wu, Fengshun, Chan, Y. C.
Published in Journal of materials science. Materials in electronics (01.04.2018)
Published in Journal of materials science. Materials in electronics (01.04.2018)
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Journal Article
Electromigration study of SnCu0.7 solder joints with Ag added by different methods
Ze Zhu, Huayu Sun, Yan-cheong Chan, Fengshun Wu
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Hermetical package of infrared sensors by Al/Ni self-propagating joining process
Wenbo Zhu, Fengshun Wu, Yanjun Xu, Changqing Liu
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
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Conference Proceeding
An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints
Peng, Hao, Chen, Guang, Mo, Liping, Chan, Y. C., Wu, Fengshun, Liu, Hui
Published in Journal of materials science. Materials in electronics (01.09.2016)
Published in Journal of materials science. Materials in electronics (01.09.2016)
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Journal Article
Novel processes to enable deposition of metal coated polymer micro-spheres for flip-chip interconnections
Junlei Tao, Whalley, David C., Changqing Liu, Fengshun Wu, Kristiansen, Helge
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Effect of interface structure on fatigue life under thermal cycle with SAC305 solder joints
Xu Yanjun, Wang Liquan, Wu Fengshun, Xia Weisheng, Liu Hui
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
Published in 2013 14th International Conference on Electronic Packaging Technology (01.08.2013)
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Conference Proceeding
In situ self-reducing Ag2O ink for the fabrication of highly flexible printed conductors
Mou, Yun, Peng, Yang, Liu, Jiaxin, Wang, Qing, Lei, Zhenyu, Wu, Fengshun, Chen, Mingxiang
Published in Materials today communications (01.12.2021)
Published in Materials today communications (01.12.2021)
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Journal Article