Simulation of the plasticizing behavior of composite modified double-base (CMDB) propellant in grooved calendar based on adaptive grid technology
Wang, Su-wei, Song, Xiu-duo, Wu, Zong-kai, Xiao, Lei, Zhang, Guang-pu, Hu, Yu-bing, Hao, Ga-zi, Jiang, Wei, Zhao, Feng-qi
Published in Defence technology (01.12.2021)
Published in Defence technology (01.12.2021)
Get full text
Journal Article
Theoretical simulations on the glass transition temperatures and mechanical properties of modified glycidyl azide polymer
Lu, Ying-ying, Shu, Yuan-jie, Liu, Ning, Shu, Yao, Wang, Ke, Wu, Zong-kai, Wang, Xiao-chuan, Ding, Xiao-yong
Published in Computational materials science (01.11.2017)
Published in Computational materials science (01.11.2017)
Get full text
Journal Article
Comparative study of melting points of 3,4-bis(3-nitrofurazan-4-yl)furoxan (DNTF)/1,3,3-trinitroazetidine (TNAZ) eutectic compositions using molecular dynamic simulations
Liu, Ning, Zeman, Svatopluk, Shu, Yuan-jie, Wu, Zong-kai, Wang, Bo-zhou, Yin, Shi-wei
Published in RSC advances (01.01.2016)
Published in RSC advances (01.01.2016)
Get full text
Journal Article
Simulation of the plasticizing behavior of composite modified double-base (CMDB) propellant in grooved calendar based on adaptive grid technology
Su-wei Wang, Xiu-duo Song, Zong-kai Wu, Lei Xiao, Guang-pu Zhang, Yu-bing Hu, Ga-zi Hao, Wei Jiang, Feng-qi Zhao
Published in 防务技术 (2021)
Published in 防务技术 (2021)
Get full text
Journal Article
Comparative study of melting points of 3,4-bis(3-nitrofurazan-4-yl)furoxan (DNTF)/1,3,3-trinitroazetidine (TNAZ) eutectic compositions using molecular dynamic simulationsElectronic supplementary information (ESI) available: All of the data used in curve fitting are listed in Tables S1-S6. The results of MSD for all temperatures are shown in Fig. S1. See DOI: 10.1039/c6ra12041e
Liu, Ning, Zeman, Svatopluk, Shu, Yuan-jie, Wu, Zong-kai, Wang, Bo-zhou, Yin, Shi-wei
Year of Publication 21.06.2016
Year of Publication 21.06.2016
Get full text
Journal Article
Method for depositing a barrier layer and thin film encapsulation structure using the same
YIM, DONG-KIL, YADAV, SANJAY D, WON, TAE KYUNG, LEE, YOUNG-DONG, CHOI, SOO YOUNG, WU, ZONG-KAI
Year of Publication 01.07.2021
Get full text
Year of Publication 01.07.2021
Patent