Effect of Different Welding Methods on Flip-Chip LED (FC-LED) Filament Properties
Li, Mengtian, Zou, Jun, Wu, Wengjuan, Shi, Mingming, Yang, Bobo, Li, Wenbo, Guo, Bin
Published in Applied sciences (01.11.2018)
Published in Applied sciences (01.11.2018)
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Journal Article
Analysis of high-temperature aging and microstructure of FC LED solder joints of a silver conductive layer bonded using SAC solder
Li, Mengtian, Zou, Jun, Wu, Wengjuan, Jiang, Nan, Liu, Yiming, Wang, Liping, Shi, Mingming, Li, Wenbo
Published in Journal of physics. Conference series (01.09.2018)
Published in Journal of physics. Conference series (01.09.2018)
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Journal Article