Effects of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers
Kim, Junmo, Song, Myoung, Gu, Chang-Yeon, Ju, Min Sang, Ma, Sung Woo, Lee, Jin Hee, Lee, Woong-Sun, Kim, Taek-Soo
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Reliability studies on micro-bumps for 3-D TSV integration
Ho-Young Son, Sung-Kwon Noh, Hyun-Hee Jung, Woong-Sun Lee, Jae-Sung Oh, Nam-Seog Kim
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
A case of amyotrophic lateral sclerosis in electronic parts manufacturing worker exposed to lead
Oh, Sung-Soo, Kim, Eun A, Lee, Sun-Woong, Kim, Min-Ki, Kang, Seong-Kyu
Published in Neurotoxicology (Park Forest South) (01.03.2007)
Published in Neurotoxicology (Park Forest South) (01.03.2007)
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Journal Article
Conference Proceeding
Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages
Ho-Young Son, Woong-Sun Lee, Seung-Kwon Noh, Min-Suk Suh, Jae-Sung Oh, Nam-Seog Kim
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
The availability of the thermal resistance model in flip-chip packages
Woong Sun Lee, Kwang Yoo Byun
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
Published in 2007 International Conference on Electronic Materials and Packaging (01.11.2007)
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Conference Proceeding
Reliability enhancement of embedded capacitors in printed circuit boards using B-stage epoxy/BaTiO3 composite embedded capacitor films (ECFs)
Sangyong Lee, Jong Min Jang, Woong Sun Lee, Kyung-Wook Paik
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
Published in 2009 59th Electronic Components and Technology Conference (01.05.2009)
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Conference Proceeding
Reliability issues on the high speed DRAM flip-chip package using gold stud bump, lead free solder, and underfill
Woong Sun Lee, Myoung Geun Park, Il Whan Cho, Sung Chul Kim, Ki Young Kim, Qwan Ho Chung, Kwang Yoo Byun
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Editorial
Sung Moon, Yoonjin Kim, Jaekyu Lee, Woong-Sun Lee, Yungi Kim, Joon-Bae Park, Taeseok Kim, Taehoon Jang, Yong Sin Kim, ByungSeong Bae, Jun-Mo Yang, Kwang-Hyun Baek
Published in Journal of semiconductor technology and science (2015)
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Published in Journal of semiconductor technology and science (2015)
Journal Article