High-temperature endurable encapsulation material
Chidambaram, V., Ho Beng Yeung, Chan Yuen Sing, Woo, D. R. M.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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