Evolution of Microstructure and Wear Resistance of Carburized Low Carbon Steel
Wongtimnoi, Komkrisd, Chowwanonthapunya, Thee
Published in International Journal of Integrated Engineering (07.03.2022)
Published in International Journal of Integrated Engineering (07.03.2022)
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Journal Article
Electrostrictive thermoplastic polyurethane-based nanocomposites filled with carboxyl-functionalized multi-walled carbon nanotubes (MWCNT-COOH): Properties and improvement of electromechanical activity
Wongtimnoi, K., Guiffard, B., Bogner-Van de Moortèle, A., Seveyrat, L., Cavaillé, J.-Y.
Published in Composites science and technology (21.08.2013)
Published in Composites science and technology (21.08.2013)
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Journal Article
Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability
Chenniki, Walide, Bord-Majek, Isabelle, Louarn, Mélanie, Gaud, Vincent, Diot, Jean-Luc, Wongtimnoi, Komkrisd, Ousten, Yves
Published in Microelectronics and reliability (01.12.2015)
Published in Microelectronics and reliability (01.12.2015)
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Journal Article
Improvement of electrostrictive properties of a polyether-based polyurethane elastomer filled with conductive carbon black
Wongtimnoi, Komkrisd, Guiffard, Benoit, Bogner-van de Moortele, Agnès, Seveyrat, Laurence, Gauthier, C., Cavaillé, Jean-Yves
Published in Composites science and technology (12.04.2011)
Published in Composites science and technology (12.04.2011)
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Journal Article
FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint
Chenniki, Walide, Bord-Majek, Isabelle, Levrier, Bruno, Wongtimnoi, Komkrisd, Diot, Jean-Luc, Ousten, Yves
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
Published in 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (01.04.2014)
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Conference Proceeding
Dispersion of functionalized SiO2 particles into a Liquid Crystal Polymer matrix for a reliable HF package
Chenniki, Walide, Bord-Majek, Isabelle, Louarn, Melanie, Gaud, Vincent, Diot, Jean-Luc, Levrier, Bruno, Verriere, Virginie, Frank, Thomas, Wongtimnoi, Komkrisd, Ousten, Yves
Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
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Published in 2013 Eurpoean Microelectronics Packaging Conference (EMPC) (01.09.2013)
Conference Proceeding