Experimental methods in monitoring voids formation during flip chip underfill cure process
Foong Chee Seng, Tee Swee Xian, Wong Tzu Ling
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
FCPBGA with SOP Pad Finishing A Study of Lead-Free Solder Ball Attach Improvement
Eu Poh Leng, Wong Tzu Ling, Amin, N., Ahmad, I.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
A Study of Lead-Free BGA Backward Compatibility Through Solderability Testing at Component Level
Eu Poh Leng, Wong Tzu Ling, Amin, N., Ahmad, I.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding
A study of lead-free BGA backward compatibility through solderability testing at component level
Eu Poh Leng, Wong Tzu Ling, Nowshad Amin, Ahmad, Ibrahim
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
BGA lead-free C5 solder system improvement by Germanium addition to Sn3.5Ag and Sn-3.8Ag-0.7Cu solder alloy
Eu Poh Leng, Wong Tzu Ling, Amin, N., Ahmad, I., Tay Yee Han, Chin Wen Chiao, Haseeb, A.S.M.A.
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
Published in 2009 11th Electronics Packaging Technology Conference (01.12.2009)
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Conference Proceeding
A comparison study on SnAgNiCo and Sn3.8Ag0.7Cu C5 lead free solder system
Eu Poh Leng, Min Ding, Wong Tzu Ling, Amin, Nowshad, Ahmad, Ibrahim, Mok Yong Lee, Haseeb, A S M A
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
Published in 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2008)
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Conference Proceeding
Semiconductor package with protective tape
Wong, Tzu Ling, Low, Boon Yew, Manikam, Vemal Raja, Manikam, Vittal Raja
Year of Publication 07.08.2012
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Year of Publication 07.08.2012
Patent
A Study of SnAgNiCo vs Sn3.8AgO. 7Cu C5 Lead Free Solder Alloy on Mechanical Strength of BGA Solder Joint
Eu Poh Leng, Min Ding, Wong Tzu Ling, Amin, N., Ahmad, I., Mok Yong Lee, Haseeb, A.S.M.A.
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
Published in 2008 10th Electronics Packaging Technology Conference (01.12.2008)
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Conference Proceeding