Dynamic warpage simulation of molded PCB under reflow process
Edmund Sek, Chun Hei, Abdullah, M.Z., Hwa Yu, Kok Hwa, Wong, Shaw Fong
Published in Circuit world (05.04.2023)
Published in Circuit world (05.04.2023)
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Journal Article
Pitfalls an engineer needs to be aware of during vibration testing
Malatkar, P., Shaw Fong Wong, Pringle, T., Wei Keat Loh
Published in 56th Electronic Components and Technology Conference 2006 (2006)
Published in 56th Electronic Components and Technology Conference 2006 (2006)
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Conference Proceeding
Dynamic characterization study of flip chip ball grid array (FCBGA) on peripheral component interconnect (PCI) board application
Wong Shaw Fong, Loh Wei Keat, Lee Yung Hsiang, Yap Eng Hooi, Wong Siang Woen, Hin Tze Yang, Martin Tay Tiong We
Published in 2005 International Symposium on Electronics Materials and Packaging (2005)
Published in 2005 International Symposium on Electronics Materials and Packaging (2005)
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Conference Proceeding
Contact Pressure and Load Measurement Techniques for Applications in Semiconductor Packaging
Yagnamurthy, Sivakumar, Klein, Steven, Haehn, Nicholas, Reynolds, Seth, Harirchian, Tannaz, Chia-Pin Chiu, Devasenathipathy, Shankar, Malatkar, Pramod, Haowen Liu, Shaw Fong Wong
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Vibration Testing and Analysis of Ball Grid Array Package Solder Joints
Shaw Fong Wong, Malatkar, P., Rick, C., Kulkarni, V., Chin, I.
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
Published in 2007 Proceedings 57th Electronic Components and Technology Conference (01.05.2007)
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Conference Proceeding
Investigation of solder bridging failure for molded matrix array package
Chong Kim Foong, Wong Shaw Fong, Leong Jenn Seong, He Yi, Lee Chee Kan, Kim Kay
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
The correlation of package coplanarity and reflow warpage to SMT
Lee Yung Hsiang, Ong Kang Eu, Loh Wei Keat, Wong Shaw Fong, Gill, Paramjeet S, Tan Kah Kee
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
On the mechanical fatigue study of second-level interconnects using the E-N curve approach
Malatkar, P., Chin, I., Chavarria, J., Kesavan, R., Shaw Fong Wong
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)
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Conference Proceeding
Solder Joint Reliability (SJR) Study of Integrated Heat Spreader (IHS) Packages
Shaw Fong Wong, Wei Keat Loh, Kang Eu Ong, Yung Hsiang Lee, Huey Ling Lew, Seok Ling Lee
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
COMPOSITE STACKED INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND METHODS OF ASSEMBLING SAME
CHEAH, Bok Eng, LO, Hungying, OOI, Ping Ping, WONG, Shaw Fong, KONG, Jackson Chung Peng
Year of Publication 24.04.2024
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Year of Publication 24.04.2024
Patent
COMPOSITE STACKED INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND METHODS OF ASSEMBLING SAME
Wong, Shaw Fong, Cheah, Bok Eng, Kong, Jackson Chung Peng, Lo, Hungying, Ooi, Ping Ping
Year of Publication 10.10.2019
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Year of Publication 10.10.2019
Patent