Detection of degradation of ABS materials via DSC
BLOM, H, YEH, R, WOJNAROWSKI, R, LING, M
Published in Journal of thermal analysis and calorimetry (2006)
Published in Journal of thermal analysis and calorimetry (2006)
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3-D electronics interconnect for high-performance imaging detectors
Kwiatkowski, K., Lyke, J., Wojnarowski, R., Kapusta, C., Kleinfelder, S., Wilke, M.
Published in IEEE transactions on nuclear science (01.08.2004)
Published in IEEE transactions on nuclear science (01.08.2004)
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3D interconnect architecture for high-bandwidth massively paralleled imager
Kwiatkowski, K., Lyke, J.C., Wojnarowski, R.J., Beche, J.-F., Fillion, R., Kapusta, C., Millaud, J., Saia, R., Wilke, M.D.
Published in Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment (21.08.2003)
Published in Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment (21.08.2003)
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Detection of degradation of ABS materials via DSC
BLOM, Henk, YEH, Rosa, WOJNAROWSKI, Robert, LING, Michael
Published in Thermochimica acta (15.03.2006)
Published in Thermochimica acta (15.03.2006)
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Advanced 3-D stacked technology
Fillion, R., Wojnarowski, R., Kapusta, C., Saia, R., Kwiatkowski, K., Lyke, J.
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
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Plastic VCSEL array packaging and high density polymer waveguides for board and backplane optical interconnect
Liu, Y.S., Wojnarowski, R.J., Hennessy, W.A., Piacente, P.A., Rowlette, J., Kadar-Kallen, M., Stack, J., Yue Liu, Peczalski, A., Nahata, A., Yardley, J.
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
Published in 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) (1998)
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Copper Deposition on Metal Filled Polymers Through Augmentative Replacement: New Method
Auerbach, A., Eichelberger, C. W., Wojnarowski, R. J.
Published in Journal of the Electrochemical Society (01.01.1983)
Published in Journal of the Electrochemical Society (01.01.1983)
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High density optical interconnects using VCSEL and polymer waveguides for board and backplane applications
Liu, Y.S., Wojnarowski, R.J., Hennessy, W.A., Rowlette, J., Stack, J., Kadar-Kallen, M., Yue Liu, Bristow, J.P., Peczalski, A., Eldada, L., Yardley, J., Osgood, R.M., Scarmozzino, R., Lee, S.H., Patra, S.
Published in Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting (1997)
Published in Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting (1997)
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Polymer optical interconnect technology (POINT) optoelectronic packaging and interconnect for board and backplane applications
Liu, Y.S., Wojnarowski, R.J., Hennessy, W.A., Bristow, J.P., Yue Liu, Peczalski, A., Rowlette, J., Plotts, A., Stack, J., Kadar-Kallen, M., Yardley, J., Eldada, L., Osgood, R.M., Scarmozzino, R., Lee, S.H., Ozgus, V., Patra, S.
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
Published in 1996 Proceedings 46th Electronic Components and Technology Conference (1996)
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Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics
Fillion, R.A., Wojnarowski, R.J., Gorcyzca, T.B., Wildi, E.J., Cole, H.S.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1995)
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.02.1995)
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High density optical interconnects for board and backplane applications using VCSELs and polymer waveguides
Liu, Y.S., Wojnarowski, R.J., Hennessy, W.A., Rowlette, J., Stack, J., Kadar-Kallen, M., Green, E., Liu, Y., Bristow, J.P., Peczalski, A., Eldada, L., Yardley, J., Osgood, R.M., Scarmozzino, R., Lee, S.H., Patra, S.
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)
Published in 1997 Proceedings 47th Electronic Components and Technology Conference (1997)
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A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technology
Gdula, M., Welles, K.B., Wojnarowski, R.J., Neugebauer, C.A., Burgess, J.F.
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
Published in 1991 Proceedings 41st Electronic Components & Technology Conference (1991)
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Plastic Encapsulated MCM Technology for High Volume, Low Cost Electronics
Fillion, R., Wojnarowski, R., Gorcyzca, T., Wildi, E., Cole, H.
Published in Circuit world (01.02.1995)
Published in Circuit world (01.02.1995)
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Low profile DC-DC power converter for 3-D electronics assembly
Korman, C.S., Ramakrishnan, S., Steigenvald, R.L., Fisher, R.A., Hennessy, W., Bicknell, W., Wojnarowski, R., Peczalski, A., Baier, S.
Published in 16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings (1997)
Published in 16th DASC. AIAA/IEEE Digital Avionics Systems Conference. Reflections to the Future. Proceedings (1997)
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Non-Digital Extensions of an Embedded Chip MCM Technology
Fillion, R.A., Wojnarowski, R.J., Bicknell, W.H., Daum, W., Forman, G.
Published in Proceedings of the International Conference on Multichip Modules (1994)
Published in Proceedings of the International Conference on Multichip Modules (1994)
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