Lead-free plastic area array BGAs and polymer stud grid arraysTM package reliability
Wojciechowski, Dominique, Chan, Moses, Martone, Fabrizio
Published in Microelectronics and reliability (01.11.2001)
Published in Microelectronics and reliability (01.11.2001)
Get full text
Journal Article
Surface Roughness Enhanced Current in Defectively Stressing Poly-Oxide-Poly Capacitors
Sheng, Lieyi, De Backer, Eddy, Wojciechowski, Dominique, De Greve, Johan, Dhondt, Kurt, Boonen, Sylvie, Malschaert, Dimitri, Snyder, Eric
Published in 2006 IEEE International Integrated Reliability Workshop Final Report (01.10.2006)
Published in 2006 IEEE International Integrated Reliability Workshop Final Report (01.10.2006)
Get full text
Conference Proceeding
New Methodology for the Characterization of EEPROM Extrinsic Behaviors
Medjahed, D., Yao, T., Wojciechowski, D., Gassot, P., Yameogo, M.
Published in 2007 IEEE International Conference on Microelectronic Test Structures (01.03.2007)
Published in 2007 IEEE International Conference on Microelectronic Test Structures (01.03.2007)
Get full text
Conference Proceeding
Encapsulating device and battery pack including such an encapsulating device
Blansaer, Eddy, Peter Dorren, Bastiaan, Den Bossche, Luc Jozef, Wojciechowski, Dominique
Year of Publication 29.01.2004
Get full text
Year of Publication 29.01.2004
Patent
Encapsulating device and battery pack including such a device
VAN DEN BOSSCHE, LUC JOZEF LOUISE, DORREN, BASTIAAN HENDRIK PETER, WOJCIECHOWSKI, DOMINIQUE, BLANSAER, EDDY
Year of Publication 01.10.2003
Get full text
Year of Publication 01.10.2003
Patent