Impact of Through Glass Vias Filling on the Performance of Passive Thermal Cooling in Photonic Packages
Gupta, Parnika, Morrissey, Padraic E., O' Brien, Peter, Krohnert, Kevin, Wohrmann, Markus, Schiffer, Michael, Kelb, Christian, Ambrosius, Norbert, Schneider-Ramelow, Martin
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Published in 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (13.09.2022)
Get full text
Conference Proceeding
Investigation and Methods Using Various Release and Thermoplastic Bonding Materials to Reduce Die Shift and Wafer Warpage for eWLB Chip-First Processes
Fowler, Michelle, Massey, John P., Braun, Tanja, Voges, Steve, Gernhardt, Robert, Wohrmann, Markus
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Get full text
Conference Proceeding
Trends in Fan-out wafer and panel level packaging
Braun, Tanja, Becker, Karl-Friedrich, Wohrmann, Markus, Topper, Michael, Bottcher, Lars, Aschenbrenner, Rolf, Lang, Klaus-Dieter
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Published in 2017 International Conference on Electronics Packaging (ICEP) (01.04.2017)
Get full text
Conference Proceeding
Impact of RDL polymer on reliability of flip chip interconnects in thermal cycling - Correlation of experiments with finite element simulations
Muller, Matthias, Wohrmann, Markus, Wittler, Olaf, Bader, Volker, Topper, Michael, Lang, Klaus-Dieter
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Published in Proceedings of the 5th Electronics System-integration Technology Conference (ESTC) (01.09.2014)
Get full text
Conference Proceeding
Reliabillity of Through Glass Vias and hermetically sealing for a versatile sensor plattform
Krohnert, Kevin, Friedrich, Georg, Starukhin, Dzmitry, Wohrmann, Markus, Schiffer, Michael, Schneider-Ramelow, Martin
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Published in 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) (15.09.2020)
Get full text
Conference Proceeding
BiCMOS Integrated Temperature Sensor for Thermal Evaluation of Fan-out Wafer-level Packaging (FOWLP) including Hot Spot Analysis
Wietstruck, Matthias, Mausolf, Thomas, Lehmann, Jens, Cao, Zhibo, Nguyen, Thanh Duy, Wohrmann, Markus, Braun, Tanja
Published in 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (12.06.2022)
Get full text
Published in 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (12.06.2022)
Conference Proceeding
High Aspect Ratio Through-Glass Vias as Heat Conductive Element
Krohnert, Kevin, Wohrmann, Markus, Schiffer, Michael, Kelb, Christian, Ambrosius, Norbert, Gupta, Parnika, Morrissey, Padraic E., O'Brien, Peter, Schneider-Ramelow, Martin
Published in 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (12.06.2022)
Get full text
Published in 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) (12.06.2022)
Conference Proceeding
High Density Thin Film Flex Technology for Advanced Packaging Applications
Zoschke, Kai, Oppermann, Hermann, Wohrmann, Markus, Kallmayer, Christine, Tschoban, Christian, Krohnert, Kevin, Lopper, Christina, Jaeger, Danny, Lutz, Mario, Wunsch, Olaf
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Get full text
Conference Proceeding
Evaluation of WLP Dielectrics for High Voltage Applications
Paeck, Marcus, Woehrmann, Markus, Toepper, Michael, Lang, Klaus-Dieter
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Get full text
Conference Proceeding
Versatile Hermetically Sealed Sensor Platform for High Frequency Applications
Krohnert, Kevin, Wohrmann, Markus, Schiffer, Michael, Friedrich, Georg, Starukhin, Dzmitry, Schneider-Ramelow, Martin, Mayer, Winfried, Chaloun, Tobias, Galler, Thomas, Waldschmidt, Christian, Schulz-Ruhtenberg, Malte, Ambrosius, Norbert, Hansen, Ulli
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Published in 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) (13.09.2021)
Get full text
Conference Proceeding
Fan-out Wafer Level Packaging of GaN Components for RF Applications
Braun, Tanja, Nguyen, Thanh Duy, Voges, Steve, Wohrmann, Markus, Gernhardt, Robert, Becker, Karl-Friedrich, Ndip, Ivan, Freimund, Damian, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Schwantuschke, Dirk, Ture, Erdin, Pretl, Michael, Engels, Sven
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Get full text
Conference Proceeding
Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks
Vereshchagina, Elizaveta, Poppe, Erik, Schjolberg-Henriksen, Kari, Wohrmann, Markus, Moe, Sigurd
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Get full text
Conference Proceeding
Spatially Resolved, Non-Destructive in-situ Detection of Interface Degradation by Remote Electrical Readout of an on-chip Thermal Pixel (Thixel) Matrix
Wunderle, Bernhard, May, Daniel, Ras, Mohmad Abo, Grosse, Corinna, Wohrmann, Markus, Bader, Volker, Keller, Jurgen
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Get full text
Conference Proceeding
Fan-Out Wafer Level Packaging - A Platform for Advanced Sensor Packaging
Braun, Tanja, Becker, Karl-Friedrich, Hoelck, Ole, Voges, Steve, Kahle, Ruben, Graap, Pascal, Wohrmann, Markus, Aschenbrenner, R., Braun, Tanja, Dreissigacker, Marc, Schneider-Ramelow, Martin, Lang, Klaus-Dieter
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Get full text
Conference Proceeding
Design and Demonstration of a Photonic Integrated Glass Interposer for Mid-Board-Optical Engines
Neitz, Marcel, Wohrmann, Markus, Ruiyong Zhang, Fikry, Mohamed, Marx, Sebastian, Schroder, Henning
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Get full text
Conference Proceeding
Delamination Detection in an Electronic Package by Means of a Newly Developed Delamination Chip Based on Thermal Pixel (Thixel) Array
Kumar, Akhil, Schulz, Marcus, Sheva, Sergey, Keller, Jurgen, Bader, Volker, Wohrmann, Markus, Bauer, Jorg, May, Daniel, Wunderle, Bernhard
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Published in 2018 7th Electronic System-Integration Technology Conference (ESTC) (01.09.2018)
Get full text
Conference Proceeding
Fabrication of High Voltage Capable TSV Using Backside via Last Process and Laser Abblation of Dry Film BCB
Mackowiak, Piotr, Wilke, Martin, Wohrmann, Markus, Gernhard, Robert, Zoschke, Kai, Lang, Klaus-Dieter, Scheider-Ramelow, Martin, Ngo, Ha-Duong
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)
Get full text
Conference Proceeding
An Overview About the Excimer Laser Ablation of Different Polymers and Their Application for Wafer and Panel Level Packaging
Gernhardt, Robert, Wohrmann, Markus, Muller, Friedrich, Hauck, Karin, Topper, Michael, Lang, Klaus-Dieter, Hichri, Habib, Arendt, Markus
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
Published in 2019 International Wafer Level Packaging Conference (IWLPC) (01.10.2019)
Get full text
Conference Proceeding
Latest advancements towards delamination detection in a FCOB assembly using Thermal Pixel (Thixel) array
Kumar, Akhil, Schulz, Marcus, Bader, Volker, Wohrmann, Markus, Bauer, Jorg, May, Daniel, Puri, Aakash, Ras, Mohamad Abo, Wunderle, Bernhard
Published in 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2019)
Published in 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) (01.09.2019)
Get full text
Conference Proceeding
Recent Developments in Panel Level Packaging
Braun, Tanja, Billaud, Mathilde, Zedel, Hannes, Stobbe, Lutz, Becker, Karl-Friedrich, Hoelck, Ole, Wohrmann, Markus, Boettcher, Lars, Topper, Michael, Aschenbrenner, R., Voges, Steve, Lang, Klaus-Dieter, Schneider-Ramelow, Martin
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
Published in 2018 International Wafer Level Packaging Conference (IWLPC) (01.10.2018)
Get full text
Conference Proceeding