Search Results - "Wilkerson, Brett P" :: K.UTB vyhledávací portál

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섬유 부착 능력을 보유한 광학 다이 라스트 웨이퍼레벨 팬아웃 패키지

by AGARWAL RAHUL, WILKERSON BRETT P, RAVICHANDRAN SIDDHARTH
Year of Publication 22.08.2023

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하이브리드 팬-아웃을 사용한 혼합 밀도 상호연결 아키텍처들

by AGARWAL RAHUL, WILKERSON BRETT P, SWAMINATHAN RAJA
Year of Publication 13.04.2023

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임베딩된 액티브 디바이스를 갖는 반도체 디바이스

by AGARWAL RAHUL, WILKERSON BRETT P, LOH GABRIEL H, SWAMINATHAN RAJA
Year of Publication 27.08.2024

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다이 장착형 전압 레귤레이터를 갖춘 3D 반도체 패키지

by AGARWAL RAHUL, WILKERSON BRETT P, LOH GABRIEL H, SWAMINATHAN RAJA
Year of Publication 27.08.2024

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광자 집적 회로를 통합한 팬아웃 모듈

by AGARWAL RAHUL, WILKERSON BRETT P, NG KONG TOON, SWAMINATHAN RAJA
Year of Publication 02.01.2024

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시스템 인 패키지, 방법 및 컴퓨터 판독가능 저장 매체

by BHAGAVAT MILIND S, AGARWAL RAHUL, WUU JOHN J, WILKERSON BRETT P
Year of Publication 31.05.2022

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Hybrid bonded interconnect bridging

by Fu, Lei, Wilkerson, Brett P, Agarwal, Rahul
Year of Publication 01.10.2024

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OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPABILITY

by WILKERSON, Brett P, RAVICHANDRAN, Siddharth, AGARWAL, Rahul
Year of Publication 01.11.2023

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ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE DIES AND PROCESSES OF FORMING THE SAME

by Fu, Lei, Wilkerson, Brett P, Swaminathan, Raja
Year of Publication 28.09.2023

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MIXED DENSITY INTERCONNECT ARCHITECTURES USING HYBRID FAN-OUT

by WILKERSON, Brett P, SWAMINATHAN, Raja, AGARWAL, Rahul
Year of Publication 21.06.2023

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Hybrid bonded interconnect bridging

by Fu, Lei, Wilkerson, Brett P, Agarwal, Rahul
Year of Publication 13.06.2023

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SEMICONDUCTOR PACKAGE WITH ANNULAR PACKAGE LID STRUCTURE

by Shah, Priyal, Wilkerson, Brett P, Swaminathan, Raja
Year of Publication 30.03.2023

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SEMICONDUCTOR DEVICE WITH AN EMBEDDED ACTIVE DEVICE

by WILKERSON, Brett P, LOH, Gabriel H, SWAMINATHAN, Raja, AGARWAL, Rahul
Year of Publication 30.10.2024

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3D SEMICONDUCTOR PACKAGE WITH DIE-MOUNTED VOLTAGE REGULATOR

by WILKERSON, Brett P, LOH, Gabriel H, SWAMINATHAN, Raja, AGARWAL, Rahul
Year of Publication 30.10.2024

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OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPABILITY

by WILKERSON, Brett P, RAVICHANDRAN, Siddharth, AGARWAL, Rahul
Year of Publication 07.07.2022

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OPTICAL DIE-LAST WAFER-LEVEL FANOUT PACKAGE WITH FIBER ATTACH CAPABILITY

by WILKERSON, BRETT P, RAVICHANDRAN, SIDDHARTH, AGARWAL, RAHUL
Year of Publication 30.06.2022

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Low temperature hybrid bonding

by Shah, Priyal, Wilkerson, Brett P, Agarwal, Rahul, Swaminathan, Raja
Year of Publication 27.02.2024

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STRUCTURAL THERMAL INTERFACING FOR LIDDED SEMICONDUCTOR PACKAGES

by SWAMINATHAN, RAJA, WILKERSON, BRETT P, SHAH, PRIYAL
Year of Publication 23.06.2022

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Offset-aligned three-dimensional integrated circuit

by Yudanov, Dmitri, Wilkerson, Brett P, Agarwal, Rahul, Bhagavat, Milind S
Year of Publication 26.12.2023

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HYBRID BONDED INTERCONNECT BRIDGING

by FU, LEI, WILKERSON, BRETT P, AGARWAL, RAHUL
Year of Publication 30.11.2023

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