Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor
Hamid, Youssef, Hutt, David A, Whalley, David C, Craddock, Russell
Published in Sensors (Basel, Switzerland) (19.03.2020)
Published in Sensors (Basel, Switzerland) (19.03.2020)
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Journal Article
Damp‐heat induced degradation in photovoltaic modules manufactured with passivated emitter and rear contact solar cells
Kyranaki, Nikoleta, Smith, Alex, Yendall, Keith, Hutt, David A., Whalley, David C., Gottschalg, Ralph, Betts, Thomas R.
Published in Progress in photovoltaics (01.09.2022)
Published in Progress in photovoltaics (01.09.2022)
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Journal Article
The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives
Wang, Shanda, Zhou, Zhaoxia, Goulas, Athanasios, Critchlow, Gary W., Whalley, David C., Hutt, David A.
Published in ACS applied materials & interfaces (10.01.2024)
Published in ACS applied materials & interfaces (10.01.2024)
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Journal Article
Finite element analysis of lead-free surface mount devices
Hegde, Pradeep, Ochana, Andrew R., Whalley, David. C., Silberschmidt, Vadim. V.
Published in Computational materials science (01.07.2008)
Published in Computational materials science (01.07.2008)
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Journal Article
Conference Proceeding
Creep damage study at powercycling of lead-free surface mount device
Hegde, Pradeep, Whalley, David C., Silberschmidt, Vadim V.
Published in Computational materials science (01.05.2009)
Published in Computational materials science (01.05.2009)
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Journal Article
Conference Proceeding
A novel flip-chip interconnection process for integrated circuits
Sugden, Mark W., Hutt, David A., Whalley, David C., Liu, Changqing
Published in Circuit world (01.01.2012)
Published in Circuit world (01.01.2012)
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Journal Article
Thermal and thermo-mechanical modelling of polymer overmoulded electronics
Sarvar, Farhad, Whalley, David C, Hutt, David A, Palmer, Paul J, Joo Teh, Nee
Published in Microelectronics international (01.01.2007)
Published in Microelectronics international (01.01.2007)
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Journal Article
A review of LED technology trends and relevant thermal management strategies
Pryde, James R., Whalley, David C., Malalasekera, Weeratunge
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
Published in Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (01.05.2014)
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Conference Proceeding
Anisotropic conducting adhesives for electronic assembly
Whalley, David C, Mannan, Samjid H, Williams, David J
Published in Microelectronics international (01.08.1999)
Published in Microelectronics international (01.08.1999)
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Journal Article
Investigation of a solder bumping technique for flip-chip interconnection
Hutt, David A, Rhodes, Daniel G, Conway, Paul P, Mannan, Samjid H, Whalley, David C, Holmes, Andrew S
Published in Soldering & surface mount technology (01.01.2000)
Published in Soldering & surface mount technology (01.01.2000)
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Journal Article
Electrical conduction characteristics of solid metal anisotropic conductive adhesive particles
Don, G., Whalley, D.C., Changqing Liu
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
Published in 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004 (2004)
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Conference Proceeding