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Sn2.5Ag0.5Cu lead free solder balls with "Ge" and "Ni"
by
Lee, R.
,
Wha Soo Sin
,
Jong Keun Jeon
,
Heui Seog Kim
Published in
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005
(2005)
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engineering
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consumer electronics
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electronic equipment testing
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engineering
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