Measuring reaction kinetics in a lab-on-a-chip by microcoil NMR
Wensink, Henk, Benito-Lopez, Fernando, Hermes, Dorothee C, Verboom, Willem, Gardeniers, Han J G E, Reinhoudt, David N, van den Berg, Albert
Published in Lab on a chip (01.01.2005)
Published in Lab on a chip (01.01.2005)
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Journal Article
Fine tuning the roughness of powder blasted surfaces
Wensink, Henk, Schlautmann, Stefan, Goedbloed, Martijn H, Elwenspoek, Miko C
Published in Journal of micromechanics and microengineering (01.09.2002)
Published in Journal of micromechanics and microengineering (01.09.2002)
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Journal Article
Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensors
Schlautmann, Stefan, Wensink, Henk, Schasfoort, Richard, Elwenspoek, Miko, Berg, Albert van den
Published in Journal of micromechanics and microengineering (01.07.2001)
Published in Journal of micromechanics and microengineering (01.07.2001)
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Journal Article
Mask materials for powder blasting
Wensink, Henk, Jansen, Henri V, Berenschot, J W, Elwenspoek, Miko C
Published in Journal of micromechanics and microengineering (01.06.2000)
Published in Journal of micromechanics and microengineering (01.06.2000)
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Journal Article
Microfabrication of palladium-silver alloy membranes for hydrogen separation
Hien Duy Tong, Berenschot, J.W.E., De Boer, M.J., Gardeniers, J.G.E., Wensink, H., Jansen, H.V., Nijdam, W., Elwenspoek, M.C., Gielens, F.C., van Rijn, C.J.M.
Published in Journal of microelectromechanical systems (01.10.2003)
Published in Journal of microelectromechanical systems (01.10.2003)
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Journal Article
Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensors: Special Issue Featuring Papers from the 11th Micromechanics Europe Workshop (MME'00)
SCHLAUTMANN, Stefan, WENSINK, Henk, SCHASFOORT, Richard, ELWENSPOEK, Miko, VAN DEN BERG, Albert
Published in Journal of micromechanics and microengineering (2001)
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Published in Journal of micromechanics and microengineering (2001)
Journal Article
Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly
Cadacio, Francisco, Wang, Teng, Salahouelhadj, Abdellah, Capuz, Giovanni, Potoms, Goedele, Rebibis, Kenneth June, Beyer, Gerald, Beyne, Eric, Gal, Wilfred, Zijl, Jurrian, Kersjes, Sebastiaan, Wensink, Henk
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
The black silicon method. VIII. A study of the performance of etching silicon using SF6/O2-based chemistry with cryogenical wafer cooling and a high density ICP source
Jansen, Henri, de Boer, Meint, Wensink, Henk, Kloeck, Ben, Elwenspoek, Miko
Published in Microelectronics (01.09.2001)
Published in Microelectronics (01.09.2001)
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Journal Article
Analytical model of micromachining of brittle materials with sharp particles
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Journal Article
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