Post‐earthquake system identification and response estimation of an elastic compound building using a simplified numerical model
Lin, Jui‐Liang, Yu, Gee‐Jin, Chuang, Ming‐Chieh, Lin, Guan‐Hong, Weng, Yuan‐Tao, Hwang, Shyh‐Jiann, Tsai, Keh‐Chyuan
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Published in Earthquake engineering & structural dynamics (01.10.2022)
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Pseudo-dynamic tests of a full-scale CFT/BRB frame-Part I: Specimen design, experiment and analysis
Tsai, Keh-Chyuan, Hsiao, Po-Chien, Wang, Kung-Juin, Weng, Yuan-Tao, Lin, Min-Lang, Lin, Ker-Chun, Chen, Chui-Hsin, Lai, Jiun-Wei, Lin, Sheng-Lin
Published in Earthquake engineering & structural dynamics (01.06.2008)
Published in Earthquake engineering & structural dynamics (01.06.2008)
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Seismic performance evaluation of a 34-story steel building retrofitted with response modification elements
Weng, Yuan-Tao, Tsai, Keh-Chyuan, Chen, Pei-Ching, Chou, Chung-Che, Chan, Ya-Ran, Jhuang, Sheng-Jhih, Wang, Yung-Yu
Published in Earthquake engineering & structural dynamics (01.05.2009)
Published in Earthquake engineering & structural dynamics (01.05.2009)
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Journal Article
Analytical studies of a full-scale steel building shaken to collapse
Yu, Yi-Jer, Tsai, Keh-Chyuan, Weng, Yuan-Tao, Lin, Bo-Zhou, Lin, Jui-Liang
Published in Engineering structures (01.10.2010)
Published in Engineering structures (01.10.2010)
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Journal Article
Effects of hysteretic models on the seismic evaluation of a collapsed irregular building from bidirectional near-fault ground motions on a shake table
Lin, Jui-Liang, Chen, Wen-Hui, Hsiao, Fu-Pei, Weng, Yuan-Tao, Shen, Wen-Cheng, Weng, Pu-Wen, Chao, Shu-Hsien, Chung, Lap-Loi, Hwang, Shyh-Jiann
Published in Engineering structures (15.11.2021)
Published in Engineering structures (15.11.2021)
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Insulation system for electronic equipment
WENG, YUAN-TAO, HUANG, SHIEH-KUNG, LIU, CHUN-HUA, HU, CHIA-HSIN, WU, CHI-HUNG
Year of Publication 01.08.2023
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Year of Publication 01.08.2023
Patent
Insulation system for electronic equipment
WENG, YUAN-TAO, HUANG, SHIEH-KUNG, LIU, CHUN-HUA, HU, CHIA-HSIN, WU, CHI-HUNG
Year of Publication 11.07.2023
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Year of Publication 11.07.2023
Patent