3-D memory organization and performance analysis for multi-processor network-on-chip architecture
Weldezion, A.Y., Zhonghai Lu, Weerasekera, R., Tenhunen, H.
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
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Conference Proceeding
Scalability of network-on-chip communication architecture for 3-D meshes
Weldezion, A.Y., Grange, M., Pamunuwa, D., Zhonghai Lu, Jantsch, A., Weerasekera, R., Tenhunen, H.
Published in 2009 3RD ACM/IEEE INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (01.01.2009)
Published in 2009 3RD ACM/IEEE INTERNATIONAL SYMPOSIUM ON NETWORKS-ON-CHIP (01.01.2009)
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Conference Proceeding
Power integrity optimization of 3D chips stacked through TSVs
Ahmad, W., Li-Rong Zheng, Weerasekera, R., Qiang Chen, Weldezion, A.Y., Tenhunen, H.
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
Published in 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (01.10.2009)
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Conference Proceeding
Physical mapping and performance study of a multi-clock 3-Dimensional Network-on-Chip mesh
Grange, M., Weldezion, A.Y., Pamunuwa, D., Weerasekera, R., Zhonghai Lu, Jantsch, A., Shippen, D.
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
Published in 2009 IEEE International Conference on 3D System Integration (01.09.2009)
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Conference Proceeding