Metallurgical bond integrity of C45 ultra fine pitch with 18μm copper wire
Wong Boh Kid, Eu Poh Leng, Lee Boon Seong, Weily, C., Yap Boon Kar
Published in 2011 IEEE Regional Symposium on Micro and Nano Electronics (01.09.2011)
Published in 2011 IEEE Regional Symposium on Micro and Nano Electronics (01.09.2011)
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Conference Proceeding
Ultra fine pitch Cu wire bonding on C45 ultra low k wafer technology
Eu Poh Leng, Chin Teik Siong, Lee Boon Seong, Leong, P, Gunasekaran, G, Song, J, Mock, K S, Siew, C W, Sivakumar, S, Wong Boh Kid, Weily, C
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
Published in 2010 12th Electronics Packaging Technology Conference (01.12.2010)
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Conference Proceeding