Impact Ionization Coefficients in 4H-SiC by Ultralow Excess Noise Measurement
Green, J. E., Wei Sun Loh, Marshall, A. R. J., Ng, B. K., Tozer, R. C., David, J. P. R., Soloviev, S. I., Sandvik, P. M.
Published in IEEE transactions on electron devices (01.04.2012)
Published in IEEE transactions on electron devices (01.04.2012)
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Journal Article
Computer modelling analysis of the globtop's effects on aluminium wirebond reliability
Hua Lu, Wei-Sun Loh, Bailey, C., Johnson, C.M.
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
Published in 2008 2nd Electronics System-Integration Technology Conference (01.09.2008)
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Conference Proceeding
Wire Bond Reliability for Power Electronic Modules - Effect of Bonding Temperature
Wei-Sun Loh, Corfield, M., Hua Lu, Hogg, S., Tilford, T., Johnson, C.M.
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
Published in 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007 (01.04.2007)
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Conference Proceeding
Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling
Agyakwa, Pearl A, Corfield, Martin R, Jian Feng Li, Wei-Sun Loh, Liotti, Enzo, Hogg, Simon C, Johnson, C Mark
Published in IEEE transactions on device and materials reliability (01.06.2010)
Published in IEEE transactions on device and materials reliability (01.06.2010)
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Magazine Article
Computer simulation of crack propagation in power electronics module solder joints
Hua Lu, Ridout, S., Bailey, C., Wei Sun Loh, Pearl, A., Johnson, M.
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
Published in 2008 International Conference on Electronic Packaging Technology & High Density Packaging (01.07.2008)
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Conference Proceeding