Silicon avalanche photodiode array fabrication for imaging application
Chee-Wei Tok, Ning Duan, Fei Sun, Guo-Qiang Lo
Published in 2012 Photonics Global Conference (PGC) (01.12.2012)
Published in 2012 Photonics Global Conference (PGC) (01.12.2012)
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Conference Proceeding
Interfacial reaction and thermal ageing of ball and stitch bonds
Murali, Sarangapani, Sureshkumar, V., Lo Miew Wan, Tok Chee Wei, Zhang Xi
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Novel coated silver (Ag) bonding wire: Bondability and reliability
Kumar, Balasubramanian Senthil, Murali, Sarangapani, Kang Il Tae, Lim Yee Weon Evonne, Tok Chee Wei, Kim Tae Yeop James, Tan Swee Seng Eric, Zhang Xi
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)
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Conference Proceeding
The process characterization of insulated Au-Flash PdCu for the challenging wire bonding applications
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
Published in 2016 IEEE 37th International Electronics Manufacturing Technology (IEMT) & 18th Electronics Materials and Packaging (EMAP) Conference (01.09.2016)
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Conference Proceeding
Insulated Au-Flash PdCu wire processing and wire bond process robustness improvements for TBGA & LQFP packages
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Zhang Xi, Loh Wan Yee, Su Dan, Tok Chee Wei
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
Published in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) (01.12.2015)
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Conference Proceeding
Bondability of copper wires on PPF leadframe
Tok Chee Wei, Ha, Johnny Yeung Ping
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Insulated PdCu wire bond challenges and resolution for HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Yow Kai Yun, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
Published in 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) (01.12.2014)
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Conference Proceeding
Challenges and resolution of insulated PdCu wire bond for TBGA HVM robustness
Siong Chin Teck, Eu Poh Leng, Tan Lan Chu, Ibrahim, Mohd Rusli, Au Ying Kheng, Zhang Xi, Lee, Cheryl, Su Dan, Tok Chee Wei, Murali, Sarangapani, Lyn, Robert
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)
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Conference Proceeding