Search Results - "Wehner, Alexander" :: K.UTB vyhledávací portál

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Power electronics submodule for mounting on a cooling device

by Bogen, Ingo, Wehner, Alexander
Year of Publication 20.12.2022

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POWER SEMICONDUCTOR MODULE

by SCHADE, MANUEL, Wehner, Alexander
Year of Publication 01.12.2022

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POWER SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE

by WEHNER, Alexander, NODERER, Manuel
Year of Publication 22.09.2022

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Power semiconductor module with press-fit contact element

by Bogen, Ingo, Wehner, Alexander
Year of Publication 12.07.2022

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POWER SEMICONDUCTOR MODULE WITH PRESS-FIT CONTACT ELEMENT

by WEHNER, Alexander, BOGEN, INGO
Year of Publication 28.10.2021

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POWER ELECTRONICS SUBMODULE FOR MOUNTING ON A COOLING DEVICE

by WEHNER, Alexander, BOGEN, Ingo
Year of Publication 26.08.2021

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Pressing device for directly or indirectly applying pressure to power-semiconductor components of a power-semiconductor module

by Bogen, Ingo, Wehner, Alexander, Noderer, Manuel
Year of Publication 17.09.2024

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Power semiconductor module having a DC voltage connecting device

by Wehner, Alexander, Steger, Jürgen, Noderer, Manuel
Year of Publication 13.08.2024

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Pressure sintering procedure in which power semiconductor components with a substrate are connected to each other via a sintered connection

by Wehner, Alexander, Steger, Juergen
Year of Publication 23.03.2021

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Press-in contact element and power semiconductor module having such contact element

by WEHNER ALEXANDER
Year of Publication 12.04.2022

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Einpresskontaktelement und Leistungshalbleitermodul hiermit

by Wehner, Alexander
Year of Publication 25.11.2021

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POWER SEMICONDUCTOR MODULE HAVING A DC VOLTAGE CONNECTING DEVICE

by WEHNER, Alexander, STEGER, Jürgen, NODERER, Manuel
Year of Publication 13.04.2023

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PRESSURE SINTERING PROCEDURE IN WHICH POWER SEMICONDUCTOR COMPONENTS WITH A SUBSTRATE ARE CONNECTED TO EACH OTHER VIA A SINTERED CONNECTION

by Steger, Juergen, WEHNER, ALEXANDER
Year of Publication 31.10.2019

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Leistungshalbleitermodul mit einem Substrat und mit einem Lastanschlusselement

by Wehner, Alexander
Year of Publication 08.07.2021

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PRESSING DEVICE FOR DIRECTLY OR INDIRECTLY APPLYING PRESSURE TO POWER-SEMICONDUCTOR COMPONENTS OF A POWER-SEMICONDUCTOR MODULE

by WEHNER, Alexander, NODERER, Manuel, BOGEN, Ingo
Year of Publication 22.12.2022

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Power electronic switching device, power semiconductor module therewith and method for production

by Bogen, Ingo, Wehner, Alexander, Steger, Jürgen, Schatz, Michael, Düsel, Markus
Year of Publication 24.10.2023

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Leistungshalbleitermodul mit einem Substrat und mit einem Lastanschlusselement

by Wehner, Alexander
Year of Publication 28.05.2020

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Leistungshalbleitermodul

by Wehner, Alexander, Schade, Manuel
Year of Publication 01.12.2022

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Power semiconductor module

by WEHNER ALEXANDER, SCHADER MARC
Year of Publication 29.11.2022

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Power semiconductor module and method for producing power semiconductor module

by WEHNER ALEXANDER, NORDEL MANUEL
Year of Publication 27.09.2022

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