FlaC, a protein of Campylobacter jejuni TGH9011 (ATCC43431) secreted through the flagellar apparatus, binds epithelial cells and influences cell invasion
Song, Y. C., Jin, S., Louie, H., Ng, D., Lau, R., Zhang, Y., Weerasekera, R., Al Rashid, S., Ward, L. A., Der, S. D., Chan, V. L.
Published in Molecular microbiology (01.07.2004)
Published in Molecular microbiology (01.07.2004)
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Journal Article
Two-Dimensional and Three-Dimensional Integration of Heterogeneous Electronic Systems Under Cost, Performance, and Technological Constraints
Weerasekera, R., Pamunuwa, D., Li-Rong Zheng, Tenhunen, H.
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.08.2009)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.08.2009)
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Journal Article
Wire-bonded through-silicon vias with low capacitive substrate coupling
FISCHER, A. C, GRANGE, M, ROXHED, N, WEERASEKERA, R, PAMUNUWA, D, STEMME, G, NIKLAUS, F
Published in Journal of micromechanics and microengineering (01.08.2011)
Published in Journal of micromechanics and microengineering (01.08.2011)
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Journal Article
Mie-Theory-Based Investigation of the Effect of Size Distribution on the Surface Plasmon Absorption of Silver Nanoparticles
Weerasekera, R. A. A. D. O., Samarakoon, D. M. L. Y., Dayalal, D. L. H. P. P., Amarasinghe, D. A. S., Samarasekara, A.M.P.B., Attygalle, Dinesh
Published in 2022 Moratuwa Engineering Research Conference (MERCon) (27.07.2022)
Published in 2022 Moratuwa Engineering Research Conference (MERCon) (27.07.2022)
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Conference Proceeding
Monolithic integration of high capacitance (power/ground) and low
Katti, G., Weiliang, Y., Weerasekera, R., Fai, Chang Ka, Dutta, R., Ho, S. W., Li, H. Y., Bhattacharya, S.
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
Published in 2015 IEEE International Conference on Electron Devices and Solid-State Circuits (EDSSC) (01.06.2015)
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Conference Proceeding
On the Impact of Through-Silicon-Via-Induced Stress on 65-nm CMOS Devices
Weerasekera, R., Hong Yu Li, Lim Wei Yi, Hu Sanming, Jinglin Shi, Je Minkyu, Keng Hwa Teo
Published in IEEE electron device letters (01.01.2013)
Published in IEEE electron device letters (01.01.2013)
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Journal Article
On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits
Weerasekera, R, Grange, M, Pamunuwa, D, Tenhunen, H
Published in 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) (01.03.2010)
Published in 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010) (01.03.2010)
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Conference Proceeding
Crosstalk immune interconnect driver design
Weerasekera, R., Li-Rong Zheng, Pamunuwa, D., Tenhunen, H.
Published in 2004 International Symposium On System-On-Chip, Proceedings (2004)
Published in 2004 International Symposium On System-On-Chip, Proceedings (2004)
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Conference Proceeding
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits
Weerasekera, R., Grange, M., Pamunuwa, D., Tenhunen, H., Li-Rong Zheng
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
Published in 2009 IEEE INTERNATIONAL CONFERENCE ON 3D SYSTEMS INTEGRATION (01.09.2009)
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Conference Proceeding
Extending systems-on-chip to the third dimension: performance, cost and technological tradeoffs
Weerasekera, R., Li-Rong Zheng, Pamunuwa, D., Tenhunen, H.
Published in 2007 IEEE/ACM International Conference on Computer-Aided Design (01.11.2007)
Published in 2007 IEEE/ACM International Conference on Computer-Aided Design (01.11.2007)
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Conference Proceeding
Delay-Balanced Smart Repeaters for On-Chip Global Signaling
Weerasekera, R., Pamunuwa, D., Li-Rong Zheng, Hannu Tenhunen
Published in 20th International Conference On VLSI Design, Proceedings (01.01.2007)
Published in 20th International Conference On VLSI Design, Proceedings (01.01.2007)
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Conference Proceeding
Analysis of signal integrity(SI) robustness in through-silicon interposer (TSI) interconnects
Weerasekera, R., Cubillo, J. R., Katti, G.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Through-Silicon Interposer (TSI) co-design optimization for high performance systems
Cubillo, J. R., Weerasekera, R., Katti, G., Patti, R.
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Design exploration of 3D stacked non-volatile memory by conductive bridge based crossbar
Yuhao Wang, Chun Zhang, Nadipalli, R., Hao Yu, Weerasekera, R.
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
Published in 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International (01.01.2012)
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Conference Proceeding