Low cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP)
Lim Ying Ying, Wee, D. H. S., Kim Hyoung Joon, Damaruganath, P.
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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