by Webb, A.P., Taunton, D.J., Hudson, D.A., Forrester, A.I.J., Turnock, S.R.
Published in Procedia engineering (2014)

by Iqbal, Z., Vepřek, S., Webb, A.P., Capezzuto, P.
Published in Solid state communications (01.03.1981)

by Vepřek, S., Iqbal, Z., Oswald, H.R., Sarott, F.-A., Wagner, J.J., Webb, A.P.
Published in Solid state communications (01.01.1981)

by Webb, A.P., Vepřek, S.
Published in Chemical physics letters (15.03.1979)

by Webb, A.P.
Published in Applied surface science (1993)

by El-Hossary, F.M., Fabian, D.J., Webb, A.P.
Published in Thin solid films (15.11.1990)

by Sahafi, H.F., Webb, A.P., Carter, M.A., Goldspink, G.F.
Published in Microelectronics (01.02.1994)

by Webb, A.P., Brewer, R., Stuessi, H., Vepřek, S.
Published in Journal of nuclear materials (01.01.1980)

by Webb, A.P., El-Hossary, F.M., Fabian, D.J., Maydell-Ondrusz, E.A.
Published in Thin solid films (01.01.1985)

by Stuessi, H., Webb, A.P., Vepřek, S.
Published in Journal of nuclear materials (01.01.1978)

by Vepřek, S., Webb, A.P., Oswald, H.R., Stuessi, H.
Published in Journal of nuclear materials (01.01.1977)

by Hughes, A.E., Webb, A.P.
Published in Solid state communications (01.01.1973)