Creep characterization of solder bumps using nanoindentation
Du, Yingjie, Liu, Xiao Hu, Fu, Boshen, Shaw, Thomas M., Lu, Minhua, Wassick, Thomas A., Bonilla, Griselda, Lu, Hongbing
Published in Mechanics of time-dependent materials (01.08.2017)
Published in Mechanics of time-dependent materials (01.08.2017)
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Journal Article
Finite Element Modeling of C4 Cracking in a Large Die Large Laminate Coreless Flip Chip Package
Shidong Li, Sinha, Tuhin, Wassick, Thomas A., Lombardi, Thomas E., Reynolds, Charles L., Quinlan, Brian W., Iruvanti, Sushumna
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Mitigating cracking within integrated circuit (IC) device carrier
Wassick, Thomas A, Lombardi, Thomas E, Tunga, Krishna R, Ostrander, Steve
Year of Publication 20.04.2021
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Year of Publication 20.04.2021
Patent
Mitigating Cracking Within Integrated Circuit (IC) Device Carrier
Wassick, Thomas A, Lombardi, Thomas E, Tunga, Krishna R, Ostrander, Steve
Year of Publication 15.10.2020
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Year of Publication 15.10.2020
Patent
COMPRESSIVE ZONE TO REDUCE DICING DEFECTS
Peterson, Kirk D, Pizzuti, Nicolas, Shaw, Thomas M, Wassick, Thomas A
Year of Publication 01.10.2020
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Year of Publication 01.10.2020
Patent
Step pyramid shaped structure to reduce dicing defects
Peterson, Kirk D, Pizzuti, Nicolas, Shaw, Thomas M, Wassick, Thomas A, Li, Shidong
Year of Publication 28.04.2020
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Year of Publication 28.04.2020
Patent
STEP PYRAMID SHAPED STRUCTURE TO REDUCE DICING DEFECTS
Peterson, Kirk D, Pizzuti, Nicolas, Shaw, Thomas M, Wassick, Thomas A, Li, Shidong
Year of Publication 16.04.2020
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Year of Publication 16.04.2020
Patent
Lead-free solder joining of electronic structures
Wassick, Thomas A, Arvin, Charles L, Quinlan, Brian W, Weiss, Thomas, Fortin, Clement J, Muzzy, Christopher D
Year of Publication 10.03.2020
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Year of Publication 10.03.2020
Patent
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
ARVIN, CHARLES L, Fortin, Clement, Wassick, Thomas A, Quinlan, Brian W, Weiss, Thomas, Muzzy, Christopher D
Year of Publication 03.01.2019
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Year of Publication 03.01.2019
Patent
All intermetallic compound with stand off feature and method to make
Wassick Thomas A, Guerin Luc, Ouimet Sylvain, Arvin Charles L, Pharand Sylvain
Year of Publication 17.10.2017
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Year of Publication 17.10.2017
Patent
Test cell for laminate and method
Iruvanti, Sushumna, Werner, Randall J, Orlowski, Marek A, Wassick, Thomas A, Tunga, Krishna R, Li, Shidong, Questad, David L, Sinha, Tuhin, Zitz, Jeffrey A
Year of Publication 02.04.2019
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Year of Publication 02.04.2019
Patent
TEST CELL FOR LAMINATE AND METHOD
Iruvanti Sushumna, Werner Randall J, Orlowski Marek A, Wassick Thomas A, Li Shidong, Tunga Krishna R, Sinha Tuhin, Zitz Jeffrey A, Questad David L
Year of Publication 15.03.2018
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Year of Publication 15.03.2018
Patent