Chip Power-Frequency Scaling in 10/7nm Node
Oldiges, Phil, Vega, Reinaldo, Utomo, Henry K., Lanzillo, Nick A., Wassick, Thomas, Li, Juntao, Wang, Junli, Shahidi, Ghavam G.
Published in IEEE access (01.01.2020)
Published in IEEE access (01.01.2020)
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Journal Article
Creep characterization of solder bumps using nanoindentation
Du, Yingjie, Liu, Xiao Hu, Fu, Boshen, Shaw, Thomas M., Lu, Minhua, Wassick, Thomas A., Bonilla, Griselda, Lu, Hongbing
Published in Mechanics of time-dependent materials (01.08.2017)
Published in Mechanics of time-dependent materials (01.08.2017)
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Journal Article
On the path to AI hardware via chiplet integration enabled by high density organic substrates
Bonilla, Griselda, Quinlan, Brian, Wassick, Thomas, Kastberg, Russell, Li, Shidong, Basutkar, Monali
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.01.2023)
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Conference Proceeding
3-D Die Stacking With 55 μm Pitch Interconnections on Advanced Ground-Rule Laminate for Artificial Intelligence System
Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Wassick, Thomas, McHerron, Dale, Divakaruni, Rama
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.05.2021)
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Journal Article
Finite Element Modeling of C4 Cracking in a Large Die Large Laminate Coreless Flip Chip Package
Shidong Li, Sinha, Tuhin, Wassick, Thomas A., Lombardi, Thomas E., Reynolds, Charles L., Quinlan, Brian W., Iruvanti, Sushumna
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
고대역폭 모듈
MUZZY CHRIS, WASSICK THOMAS ANTHONY, SINGH BHUPENDER, ARVIN CHARLES LEON, LI SHIDONG
Year of Publication 05.10.2022
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Year of Publication 05.10.2022
Patent
Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware
Taneja, Divya, Grenier, Jonathan, Ross, Joseph, Mori, Horiyuki, Raghvan, Sathya, Quinlan, Brian, De Sousa, Isabel, Wassick, Thomas, Bonilla, Griselda
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints
Horibe, Akihiro, Watanabe, Takahito, Marushima, Chinami, Kohara, Sayuri, Yamada, Yasuharu, Mori, Hiroyuki, Taneja, Divya, Pilger, Katherine, Jacques-Fortin, Alexis, Godard, Maxime, Chen, Qianwen, Perfecto, Eric, Jain, Aakrati, Ross, Joseph R, Wassick, Thomas, De Sousa, Isabel
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
Published in 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) (28.05.2024)
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Conference Proceeding
Solder Bump Electromigration and CPI Challenges in Low-k Devices
Susko, Robin, Daubenspeck, Timothy, Wassick, Thomas, Sullivan, Timothy, Sauter, Wolfgang, Cincotta, John
Published in ECS transactions (20.03.2009)
Published in ECS transactions (20.03.2009)
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Journal Article
Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
Pulido, Claudia Cristina Barrera, Kohara, Sayuri, Jain, Aakrati, Wassick, Thomas, Taneja, Divya, McInnes, Philip, Horibe, Akihiro, De Sousa, Isabel
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
Direct Bonded Heterogeneous Integration (DBHi) Si Bridge
Sikka, Kamal, Bonam, Ravi, Liu, Yang, Andry, Paul, Parekh, Dishit, Jain, Aakrati, Bergendahl, Marc, Divakaruni, Rama, Cournoyer, Maryse, Gagnon, Pascale, Dufort, Catherine, de Sousa, Isabel, Zhang, Hongqing, Cropp, Ed, Wassick, Thomas, Mori, Hiroyuki, Kohara, Sayuri
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55\ \mu\mathrm-75\ \mu \mathrm Mixed Pitch Interconnections on High Density Laminate
Sakuma, Katsuyuki, Farooq, Mukta, Andry, Paul, Cabral, Cyril, Rajalingam, Sankeerth, McHerron, Dale, Li, Shidong, Kastberg, Russell, Wassick, Thomas
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
Published in 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (01.06.2021)
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Conference Proceeding
Comparison of electromigration behaviors of SnAg and SnCu solders
Minhua Lu, Da-Yuan Shih, Goldsmith, C., Wassick, T.
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
Published in 2009 IEEE International Reliability Physics Symposium (01.04.2009)
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Conference Proceeding
HIGH BANDWIDTH MODULE
MUZZY, Chris, LI, Shidong, WASSICK, Thomas, Anthony, SINGH, Bhupender, ARVIN, Charles, Leon
Year of Publication 17.01.2024
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Year of Publication 17.01.2024
Patent
High bandwidth module
Arvin, Charles Leon, Singh, Bhupender, Li, Shidong, Muzzy, Chris, Wassick, Thomas Anthony
Year of Publication 12.09.2023
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Year of Publication 12.09.2023
Patent
CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST
Wagner, Grant, Chun, Sungjun, Harrer, Hubert, Grady, Matthew Sean, Kumar, Arvind, Wassick, Thomas Anthony, Ostrander, Steven Paul, Audette, David Michael
Year of Publication 27.06.2024
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Year of Publication 27.06.2024
Patent
High bandwidth module
MUZZY, Chris, ARVIN, Charles Leon, LI, Shidong, SINGH, Bhupender, WASSICK, Thomas Anthony
Year of Publication 15.06.2023
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Year of Publication 15.06.2023
Patent
Multi chip hardware security module
Santiago-Fernandez, William, Iruvanti, Sushumna, Buchling Rego, Philipp K, Hadzic, Nihad, Wassick, Thomas Anthony, Busby, James, Ostrander, Steven Paul
Year of Publication 23.01.2024
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Year of Publication 23.01.2024
Patent
HIGH BANDWIDTH MODULE
MUZZY, Chris, LI, Shidong, WASSICK, Thomas, Anthony, SINGH, Bhupender, ARVIN, Charles, Leon
Year of Publication 18.01.2023
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Year of Publication 18.01.2023
Patent
Functional Testing of AI Cores through Thinned 3D I/O Buffer Dies in 3D Die-Stacked Modules
Farooq, Mukta, Kumar, Arvind, Lee, Sae-Kyu, Bonam, Ravi, Gomez, Juan-Manuel, Kelly, James, Hosokawa, Kohji, Nomura, Akiyo, Kohda, Yasuteru, Dickson, Timothy, Sakuma, Katsuyuki, Mori, Hiroyuki, Rubin, Joshua, Saraf, Iqbal, Pai, Vinay, Nieves, Pablo, Li, Yandong, DelaPena, Abraham, Wassick, Thomas, Perfecto, Eric, Carr, Christopher, Sardesai, Viraj, Miller, Eric, Oakley, Jennifer, Skordas, Spyridon, Teehan, Sean, McHerron, Dale, Burns, Jeff, Divakaruni, Rama
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding