Ultra thick epoxy-based dry-film resist for high aspect ratios
Wangler, N., Beck, S., Ahrens, G., Voigt, A., Grützner, G., Müller, C., Reinecke, H.
Published in Microelectronic engineering (01.09.2012)
Published in Microelectronic engineering (01.09.2012)
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Journal Article
A versatile and flexible low-temperature full-wafer bonding process of monolithic 3D microfluidic structures in SU-8
Steigert, J, Brett, O, Müller, C, Strasser, M, Wangler, N, Reinecke, H, Daub, M, Zengerle, R
Published in Journal of micromechanics and microengineering (01.09.2008)
Published in Journal of micromechanics and microengineering (01.09.2008)
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Journal Article
Bubble Jet agent release cartridge for chemical single cell stimulation
Wangler, N., Welsche, M., Blazek, M., Blessing, M., Vervliet-Scheebaum, M., Reski, R., Müller, C., Reinecke, H., Steigert, J., Roth, G., Zengerle, R., Paust, N.
Published in Biomedical microdevices (01.02.2013)
Published in Biomedical microdevices (01.02.2013)
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Journal Article
A modular diffusion barrier based on phase separation for localized delivery of discrete drug volumes in aqueous environments
Steigert, Juergen, Strasser, Monika, Wangler, Nicolai, Brett, Olivia, Streule, Wolfgang, Koltay, Peter, Daub, Martina, Zengerle, Roland
Published in Lab on a chip (01.01.2009)
Published in Lab on a chip (01.01.2009)
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Journal Article