Effects of Repetitive Mechanical Bending Strain on Various Dimensions of Foldable Low Temperature Polysilicon TFTs Fabricated on Polyimide
Bo-Wei Chen, Ting-Chang Chang, Yu-Ju Hung, Shin-Ping Huang, Po-Yung Liao, Chung-Yi Yang, Ann-Kuo Chu, Tai-Jui Wang, Terry, Tsu-Chiang Chang, Bo-Yuan Su, Su-Chun Kuo, Huang, I.-Yu
Published in IEEE electron device letters (01.08.2016)
Published in IEEE electron device letters (01.08.2016)
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Journal Article
Enhancement of Mechanical Bending Stress Endurance Using an Organic Trench Structure in Foldable Polycrystalline Silicon TFTs
Zheng, Yu-Zhe, Huang, Shin-Ping, Chen, Po-Hsun, Chang, Ting-Chang, Tsai, Tsung-Ming, Chu, Ann-Kuo, Hung, Yang-Hao, Shih, Yu-Shan, Wang, Yu-Xuan, Wu, Chia-Chuan, Tu, Yu-Fa, Chen, Yu-An, Sun, Pei-Jun, Chung, Yu-Hua, Chen, Wei-Han, Wang, Tai-Jui
Published in IEEE electron device letters (01.05.2020)
Published in IEEE electron device letters (01.05.2020)
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Journal Article
Nickel Nanocrystals Embedded in Metal--Alumina--Nitride--Oxide--Silicon Type Low-Temperature Polycrystalline-Silicon Thin-Film Transistor for Low-Voltage Nonvolatile Memory Application
Wang, Terry Tai-Jui, Liu, Yu-Cheng, Wu, Chien-Hung, Lu, Tien-Lin, Hsieh, Ing-Jar, Kuo, Cheng-Tzu
Published in Japanese Journal of Applied Physics (01.06.2011)
Published in Japanese Journal of Applied Physics (01.06.2011)
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Journal Article
Low-Temperature Polycrystalline Silicon Thin Film Transistor Nonvolatile Memory Using Ni Nanocrystals as Charge-Trapping Centers Fabricated by Hydrogen Plasma Process
Wang, Terry Tai-Jui, Gao, Pei-Ling, Ma, William Cheng-Yu, Kuo, Cheng-Tzu
Published in Japanese Journal of Applied Physics (01.06.2010)
Published in Japanese Journal of Applied Physics (01.06.2010)
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Journal Article
Abnormal - Hump Effect Induced by Hot Carriers in Gate Length-Dependent p-Type LTPS TFTs
Huang, Shin-Ping, Shih, Yao-Kai, Chung, Yu-Hua, Chen, Wei-Han, Wang, Terry Tai-Jui, Zhang, Sheng-Dong, Chang, Ting-Chang, Chen, Po-Hsun, Tsao, Yu-Ching, Chen, Hong-Chih, Zheng, Yu-Zhe, Chu, Ann-Kuo, Shih, Yu-Shan, Wang, Yu-Xuan, Wu, Chia-Chuan
Published in IEEE transactions on electron devices (01.11.2019)
Published in IEEE transactions on electron devices (01.11.2019)
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Journal Article
Surface Engineering of Polycrystalline Silicon for Long-Term Mechanical Stress Endurance Enhancement in Flexible Low-Temperature Poly-Si Thin-Film Transistors
Chen, Bo-Wei, Chang, Ting-Chang, Chang, Kuan-Chang, Hung, Yu-Ju, Huang, Shin-Ping, Chen, Hua-Mao, Liao, Po-Yung, Lin, Yu-Ho, Huang, Hui-Chun, Chiang, Hsiao-Cheng, Yang, Chung-I, Zheng, Yu-Zhe, Chu, Ann-Kuo, Li, Hung-Wei, Tsai, Chih-Hung, Lu, Hsueh-Hsing, Wang, Terry Tai-Jui, Chang, Tsu-Chiang
Published in ACS applied materials & interfaces (05.04.2017)
Published in ACS applied materials & interfaces (05.04.2017)
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Journal Article
Enhancing Repetitive Uniaxial Mechanical Bending Endurance at = 2 mm Using an Organic Trench Structure in Foldable Low Temperature Poly-Si Thin-Film Transistors
Huang, Shin-Ping, Zheng, Yu-Zhe, Chang, Ting-Chang, Chen, Bo-Wei, Chen, Po-Hsun, Chu, Ann-Kuo, Chen, Hong-Chih, Tsao, Yu-Ching, Chen, Min-Chen, Chen, Wei-Han, Wang, Terry Tai-Jui, Kanicki, Jerzy, Zhang, Sheng-Dong
Published in IEEE electron device letters (01.06.2019)
Published in IEEE electron device letters (01.06.2019)
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Journal Article
Using Conductive Fabric for Multi-Channel Capacitive ECG Measurement
Chen, Yin Sheng, Wang, Tai-Jui, Chiu, Hsien Wei, Lin, Yue-Der
Published in 2022 IEEE 22nd International Conference on Bioinformatics and Bioengineering (BIBE) (01.11.2022)
Published in 2022 IEEE 22nd International Conference on Bioinformatics and Bioengineering (BIBE) (01.11.2022)
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Conference Proceeding
Capactive EMG Measurement with Passive Capacitive Electrode
Chen, Yin Sheng, Wang, Tai-Jui, Chiu, Hsien Wei, Lin, Yue-Der
Published in 2022 IEEE 22nd International Conference on Bioinformatics and Bioengineering (BIBE) (01.11.2022)
Published in 2022 IEEE 22nd International Conference on Bioinformatics and Bioengineering (BIBE) (01.11.2022)
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Conference Proceeding
Spray pyrolysis coating Al2O3:Cl/TiO2 bilayer for PERC
Hsing-Hua Wu, Kuei-Bo Chen, Huang, Walt K. W., Nai-Tien Ou, Chung-Han Wu, Sheng-min Yu, Wan-Ying Chou, Sung-Yen Wei, Tai-Jui Wang, Wen-Ching Sun
Published in 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC) (01.06.2014)
Published in 2014 IEEE 40th Photovoltaic Specialist Conference (PVSC) (01.06.2014)
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Conference Proceeding
Nickel Nanocrystals Embedded in Metal–Alumina–Nitride–Oxide–Silicon Type Low-Temperature Polycrystalline-Silicon Thin-Film Transistor for Low-Voltage Nonvolatile Memory Application
Wang, Terry Tai-Jui, Liu, Yu-Cheng, Wu, Chien-Hung, Lu, Tien-Lin, Hsieh, Ing-Jar, Kuo, Cheng-Tzu
Published in Japanese Journal of Applied Physics (01.06.2011)
Published in Japanese Journal of Applied Physics (01.06.2011)
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Low temperature Ni-nanocrystals-assisted hybrid polycrystalline silicon thin film transistor for non-volatile memory applications
Wang, Terry Tai-Jui, Ma, William Cheng-Yu, Hung, Shih-Wei, Kuo, Cheng-Tzu
Published in Thin solid films (01.10.2010)
Published in Thin solid films (01.10.2010)
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Conference Proceeding
Evaluation of Chip-Last Fan-Out Panel Level Packaging with G2.5 LCD Facility Using FlexUPTM and Mechanical De-bonding Technologies
Wei-Yuan Cheng, Chen-Tsai Yang, Jie-Mo Lin, Wei-Han Chen, Tai-Jui Wang, Yuh-Zheng Lee
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems
Cheng, Wei-Yuan, Cheng, Shau-Fei, Yang, Chen-Tsai, Cheng, Shau-Fei, Chen, Wei-Han, Lai, Hsin-Cheng, Wang, Tai-Jui, Lee, Yuh-Zheng
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding