Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines
Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2020)
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Journal Article
Vacuum Brazing Ti–15–3 with a TiNiNb Braze Alloy
Kao, Chuan-Sheng, Tsay, Leu-Wen, Wang, Shan-Bo, Shiue, Ren-Kae
Published in Metals (Basel ) (01.10.2019)
Published in Metals (Basel ) (01.10.2019)
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Zircon U-Pb ages and provenance characteristics of the Zhiluo Formation sandstones and the formation background of the uranium deposit in Huangling area, Ordos Basin, China
Yu, Reng-an, Wang, Shan-bo, Zhu, Qiang, Si, Qing-hong, Teng, Xue-ming, Liu, Xiao-xue, Liu, Hou-ning, Tang, Yong-xiang
Published in China Geology (01.12.2021)
Published in China Geology (01.12.2021)
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Journal Article
The Application of 40Ti-35Ni-25Nb Filler Foil in Brazing Commercially Pure Titanium
Wang, Shan-Bo, Kao, Chuan-Sheng, Tsay, Leu-Wen, Shiue, Ren-Kae
Published in Metals (Basel ) (01.03.2018)
Published in Metals (Basel ) (01.03.2018)
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Journal Article
Applications of Ni and Ag metallizations at the solder/Cu interfaces in advanced high-power automobile interconnects: An electromigration study
Chiu, Meng-Chun, Tsai, Min-Yan, Wang, Shan-Bo, Lin, Yung-Sheng, Liang, Chien-Lung
Published in Surface & coatings technology (30.05.2024)
Published in Surface & coatings technology (30.05.2024)
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Journal Article
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density
Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Gao-Tian, Lin, Kwang-Lung
Published in Materials chemistry and physics (01.12.2020)
Published in Materials chemistry and physics (01.12.2020)
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Journal Article
An Electromigration Study of Cu Pillar Interconnects in Flip-chip QFN Packaging under Extreme Conditions for High-power Applications
Tsai, Min-Yan, Kao, Chin-Li, Wang, Shan-Bo, Lin, Yung-Sheng, Chiu, Meng-Chun, Liang, Chien-Lung
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
Published in 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) (05.12.2023)
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Conference Proceeding
CLEEGN: A Convolutional Neural Network for Plug-and-Play Automatic EEG Reconstruction
Lai, Pin-Hua, Wang, Bo-Shan, Yang, Wei-Chun, Tsou, Hsiang-Chieh, Wei, Chun-Shu
Published in arXiv.org (21.02.2024)
Published in arXiv.org (21.02.2024)
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Paper
Journal Article
Direct Observation of Void Nucleation and Growth in a 2-µm-Wide Cu Redistribution Line During In Situ Electromigration
Liang, Chien-Lung, Lin, Yung-Sheng, Tsai, Min-Yan, Chiu, Meng-Chun, Wang, Shan-Bo, Hung, Chih-Pin, Lin, Kwang-Lung
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)
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Conference Proceeding
Novel Ga Assisted Low-temperature Bonding Technology for Fine-pitch Interconnects
Wang, Shan-Bo, Hsu, An-Hsuan, Kao, Chin-Li, Tarng, David, Liang, Chien-Lung, Lin, Kwang-Lung
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
Published in 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (01.05.2022)
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Conference Proceeding
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging
Liang, Chien-Lung, Lin, Yung-Sheng, Kao, Chin-Li, Tarng, David, Wang, Shan-Bo, Hung, Yun-Ching, Lin, Kwang-Lung
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
Published in 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) (01.06.2020)
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Conference Proceeding
Zircon U-Pb ages and provenance characteristic of sandstone from Zhiluo Formation and debating of formation background of uranium deposit in Huangling area, Ordos Basin, China
Yu, Reng-an, Wang, Shan-bo, Zhu, Qiang, Si, Qing-hong, Teng, Xue-ming, Liu, Xiao-xue, Liu, Hou-ning, Tang, Yong-xiang
Published in China geology (2021)
Published in China geology (2021)
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Journal Article
Zhuiqiu kexue jingshen: Zhong-Xi kexue bijiao yu rongtong de zhexue toushi [zhui][qiu][ke][xue][jing][shen] : [zhong][xi][ke][xue][bi][jiao][yu][rong][tong][de][zhe][xue][tou][shi] (Seeking the Soul of Science: Science in China and the West Compared through an Understanding of Philosophical Perspective)
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Book Review
Prostate cancer antigen 3 moderately improves diagnostic accuracy in Chinese patients undergoing first prostate biopsy
Wang, Fu-Bo, Chen, Rui, Ren, Shan-Cheng, Shi, Xiao-Lei, Zhu, Ya-Sheng, Zhang, Wei, Jing, Tai-Le, Zhang, Chao, Gao, Xu, Hou, Jian-Guo, Xu, Chuan-Liang, Sun, Ying-Hao
Published in Asian journal of andrology (01.03.2017)
Published in Asian journal of andrology (01.03.2017)
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