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"Wang, Meng-Jen"
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"Wang, Meng-Jen"
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Package and method of making the same
by
WANG
,
MENG
-
JEN
Year of Publication
16.08.2008
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202
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Microelectromechanical system package and the method for manufacturing the same
by
WANG
,
MENG
-
JEN
Year of Publication
16.08.2008
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CHIP PACKAGE STRUCTURE
by
WANG MENG
-
JEN
,
WANG WEIUNG
,
WANG TONG-HONG
Year of Publication
06.11.2008
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204
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Releasing structure of a controllable cap and releasing method thereof
by
WANG
,
MENG
-
JEN
Year of Publication
16.07.2008
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205
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CHIP PACKAGE STRUCTURE
by
CHUNG CHIH-MING
,
WANG MENG
-
JEN
Year of Publication
01.09.2005
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206
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Micro electro-mechanical system device and manufacturing method thereof
by
WANG
,
MENG
-
JEN
Year of Publication
01.07.2008
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207
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CHIP HERMETIC PACKAGE DEVICE AND METHOD FOR PRODUCING THE SAME
by
WANG MENG
-
JEN
,
YANG KUO-PIN
,
PENG SHENG-YANG
Year of Publication
25.09.2008
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208
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Method for making flip chip on leadframe package
by
WANG MENG
-
JEN
,
LIU CHIEN
,
HUANG TSAN-SHENG
Year of Publication
16.09.2008
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Method for making flip chip on leadframe package
by
Wang
,
Meng
-
Jen
,
Liu, Chien
,
Huang, Tsan-Sheng
Year of Publication
16.09.2008
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210
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Chip package
by
CHUNG, CHIH-MING
,
WANG
,
MENG
-
JEN
Year of Publication
11.07.2005
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211
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METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE HAVING MICRO-ELECTRO-MECHANICAL SYSTEMS
by
WANG MENG
-
JEN
,
YANG HSUEH-AN
Year of Publication
07.08.2008
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212
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FLIP CHIP PACKAGE WITH ANTI-FLOATING STRUCTURE
by
TSAI SHENG-TAI
,
WANG MENG
-
JEN
,
LIU CHIEN
Year of Publication
31.07.2008
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Semiconductor Element Having a Conductive Via and Method for Making the Same and Package Having a Semiconductor Element with a Conductive Via
by
CHIU CHI-TSUNG
,
WANG MENG
-
JEN
,
OU YING-TE
Year of Publication
24.03.2011
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214
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Flip chip package with anti-floating structure
by
Liu, Chien
,
Wang
,
Meng
-
Jen
,
Tsai, Sheng-Tai
Year of Publication
06.05.2008
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215
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Flip chip package with anti-floating structure
by
TSAI SHENG-TAI
,
WANG MENG
-
JEN
,
LIU CHIEN
Year of Publication
06.05.2008
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Face-to-face multi-chip flip-chip package
by
Wang
,
Meng
-
Jen
,
Chen, Yu-Wen
Year of Publication
30.11.2004
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217
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Recyclable stamp device and recyclable stamp process for wafer bond
by
CHEN, JIUNN
,
WANG
,
MENG JEN
Year of Publication
11.05.2010
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218
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Semiconductor chip package and method for manufacturing the same
by
LIU, CHIEN
,
WANG
,
MENG JEN
Year of Publication
11.03.2010
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Semiconductor device having integrated passive device and process for manufacturing the same
by
CHEN, CHIEN HUA
,
LEE, PAO NAN
,
LEE, TECKONG
,
WANG
,
MENG JEN
Year of Publication
21.10.2016
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Ball grid array package
by
WANG MENG
-
JEN
,
LEE CHUN-YANG
,
KAO CHUNG-YAO
Year of Publication
23.08.2007
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