Enhanced Design and Reliability Analysis of Copper Post Wafer Level Package
Kuei Hsiao Kuo, Chen, Austin, Yen Neng Wang, Jiunn Jie Wang, Chang, Jovi, Feng Lung Chien, Lee, Rick
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Development of a no Reflow Cu Pillar Bump to Improve Chip/Package Interactions (CPI) Process and Reliability Performance
Kuo, Kuei Hsiao, Wang, Jiunn Jie, Wang, Yen Neng, Chien, Feng Lung, Lee, Rick
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
Published in 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) (01.05.2019)
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Conference Proceeding