Integrated High Aspect Ratio 3D High Density Capacitor in Si Interposer for 2.5D Advanced Packaging Applications
Lu, Chun-Lin, Ho, Cheng-Shu, Liu, Kuo-Wei, Wang, Guan-Deng, Ju, Min-Syong, So, Ka Man, Shih, Kai-Yao, Liao, Miller, Chang, Shou-Zen
Published in 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) (17.04.2023)
Published in 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) (17.04.2023)
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Conference Proceeding
Preoperative predictors of portal vein thrombosis after splenectomy with periesophagogastric devascularization
Zhang, Yu, Wen, Tian-Fu, Yan, Lu-Nan, Yang, Hong-Ji, Deng, Xiao-Fan, Li, Chuan, Wang, Chuan, Liang, Guan-Lin
Published in World journal of gastroenterology : WJG (21.04.2012)
Published in World journal of gastroenterology : WJG (21.04.2012)
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Journal Article