Thermal considerations about modern energy saving power-MOSFET: Is the reduced thickness of the silicon a drawback for short high power load conditions?
Walter, Ralf
Published in IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society (01.11.2013)
Published in IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society (01.11.2013)
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Conference Proceeding
Studies of highly filled composite based on two-component organic binder stress state in thermal stress
Erdakov, Ivan N., Ivanov, Vassily A., Pashnyov, Vladislav A., Fekolin, Pavel. V., Davydov, Vadim, Walter, Ralf, Pimenov, Danil Yu
Published in Procedia manufacturing (2018)
Published in Procedia manufacturing (2018)
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Journal Article
ANKA–Service-Oriented Synchrotron Radiation Facility
Babayan, Ruben Albert, Birkel, Ingrid, Buth, Gernot, Doyle, Stephen, Einfeld, Dieter, Göttert, Jost, Hagelstein, Michael, Hermle, Stefan, Hesch, Klaus, Huttel, Erhard, Krüssel, Alois, Lange, Michael, Mathis, Yves-Laurent, Mexner, Wolfgang, Moser, Herbert O., Pellegrin, Eric, Perez, Francisco, Pont, Montse, Ristau, Uwe, Rossmanith, Robert, Sajosch, Heinrich, Schieler, Harald, Simon, Rolf, Steininger, Ralph, Voigt, Siegfried, Walter, Ralf, Weimar, Edmund, Weinl, Andreas
Published in Japanese Journal of Applied Physics (01.01.1999)
Published in Japanese Journal of Applied Physics (01.01.1999)
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Journal Article