Low temperature sintering process for deposition of nano-structured metal for nano IC packaging
Wong Wai Kwan, Kripesh, V., Iyer, M.K., Gupta, M., Tay, A.A.O., Tummala, R.
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)
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Conference Proceeding
UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packaging
Seung Wook Yoon, Kripesh, V., Wong Wai Kwan, Li Chao Yong, Chen Man Tong, Gui Dong, Rasiah, I.J., Iyer, M.K.
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
Published in 53rd Electronic Components and Technology Conference, 2003. Proceedings (2003)
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Conference Proceeding
Wafer level packages and methods of fabrication
Kripesh, Vaidyanathan, Wong, Wai Kwan, Rotaru, Mihai Dragos, Chai, Tai Chong, Iyer, Mahadevan Krishna
Year of Publication 13.03.2007
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Year of Publication 13.03.2007
Patent
Wafer level packages and methods of fabrication
ROTARU MIHAI DRAGOS, CHAI TAI CHONG, IYER MAHADEVAN KRISHNA, WONG WAI KWAN, KRIPESH VAIDYANATHAN
Year of Publication 13.03.2007
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Year of Publication 13.03.2007
Patent
Wafer level packages and methods of fabrication
ROTARI MIHAL DRAGOS, CHAI TAI CHONG, VAIDYANATHAN KRIPESH, WONG WAI KWAN, MAHADEVAN KRISHNA IYER
Year of Publication 26.04.2006
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Year of Publication 26.04.2006
Patent
Wafer level packages and methods of fabrication
ROTARU MIHAI D, IYER MAHADEVAN K, CHAI TAI CHONG, WONG WAI KWAN, KRIPESH VAIDYANATHAN
Year of Publication 16.03.2006
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Year of Publication 16.03.2006
Patent