by Ee Lin Chung, Dandong Ge, Chee Mun Wai
Published in 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) (01.12.2017)

by Rivai, Ahmad, Mun, Wai Chee, Bapokutty, Omar
Published in Applied Mechanics and Materials (01.10.2014)

by Mun Wai, Chee, Ryan Tordillo, Comadre, Mohd Kahar, Bajuri, Emil Lamco, Jocson, Edmund Banogon, Selorio
Published in 2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT) (19.10.2022)

by Tan, Lay Tatt, Tan, Wee Kien, Wai, Chee Mun
Published in 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (01.12.2019)

by ., Wai Chee Mun
Published in International journal of research in engineering and technology (25.10.2013)

by Lamco, Jocson Emil, Kahar, Bajuri Mohd, Mun, Wai Chee
Published in 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT) (01.09.2018)

by Wong, Fee Hoon Wendy, Morban, Norliza, Chiang, Chau Fatt, Tey, Sock Chien, Wai, Chee Mun, Ismail, Badrul Hisyam, Mohd Salleh, Ronizan, Loo, Desmond Jenn Yong, Yeo, Si Hao Vincent, Ang, Keck Tim, Cha, Chan Lam
Year of Publication 01.06.2023

by Loo, Jenn Yong, Morban, Norliza, Chiang, Chau Fatt, Tey, Sock Chien, Wai, Chee Mun, Ismail, Badrul Hisyam, Mohd Salleh, Ronizan, Wong, Fee Hoon, Cha, Chan Lam, Ang, Keck Tim, Vincent Yeo, Si Hao
Year of Publication 01.06.2023